ATS-17D-50-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17D-50-C3-R0-ND

Manufacturer Part#:

ATS-17D-50-C3-R0

Price: $ 3.54
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17D-50-C3-R0 datasheetATS-17D-50-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.22182
30 +: $ 3.13467
50 +: $ 2.96050
100 +: $ 2.78630
250 +: $ 2.61218
500 +: $ 2.52510
1000 +: $ 2.26388
Stock 1000Can Ship Immediately
$ 3.54
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 19.22°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-17D-50-C3-R0 Application Field and Working Principle

Thermal - Heat Sinks

Heat sinks have been widely used in various industries for many years due to their excellent performance in dissipating heat. Heat sinks, such as the ATS-17D-50-C3-R0, are important components in many applications, such as in cooling mechanisms, in electronic boards such as PCs and servers, and in industrial plants. In order to properly understand its workings, it is important to understand the principles of the thermal performance of the heat sink.

Heat sinks mechanically transfer heat away from the point of origin utilizing fins or louvers that increase the surface area exposed to the surrounding environment. Heat is then dissipated to the environment from the increased surface area with air being the most common medium. The size, shape and design of the heat sink’s fins or vane greatly influence the thermal performance; larger and thicker fins or vane will offer better thermal performance.

The ATS-17D-50-C3-R0 is a 1U passive heatsink designed to cool CPUs, GPUs and memory. It is made of aluminum and has an optimal air gap that maximizes heatsink performance with superior performance than most other heatsinks in this series. With excellent heat dissipation performance and low noise, this heatsink can be used in a variety of applications.

The ATS-17D-50-C3-R0 features a double-huge space vane design, which is specifically designed for cooling CPUs, GPUs, and memory up to 95 watts using natural convection. The double-huge space vane creates an efficient air flow that captures the heat from the CPU and transfers it to the heatsink. It also features a patented smoke exhaust fan design that reduces fan noise significantly, while maintaining a low overall thermal noise. The ATS-17D-50-C3-R0 also includes a unique fin structure that increases the thermal transfer surface area and reduces hot spots on the heatsink for better cooling performance.

In addition to its excellent thermal performance, the ATS-17D-50-C3-R0 also features an integrated air duct system that provides additional cooling potential when used in tandem with other fans. This air duct system is designed to guide air efficiently across the entire heatsink for better cooling and thermal performance. This system also helps reduce fan noise as it does not require fans to run at high speeds.

The ATS-17D-50-C3-R0 thermal performance is achieved by a combination of the efficient air flow generated by its double-huge space vane design, its patented smoke exhaust fan design, and its integrated air duct system. This combination of features make the ATS-17D-50-C3-R0 one of the most effective and reliable types of heatsinks on the market. The ATS-17D-50-C3-R0 is ideal for applications such as PCs, servers, industrial plants, and cooling systems.

The specific data is subject to PDF, and the above content is for reference

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