ATS-17D-51-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17D-51-C3-R0-ND

Manufacturer Part#:

ATS-17D-51-C3-R0

Price: $ 3.65
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X20MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17D-51-C3-R0 datasheetATS-17D-51-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.31695
30 +: $ 3.22707
50 +: $ 3.04781
100 +: $ 2.86858
250 +: $ 2.68930
500 +: $ 2.59965
1000 +: $ 2.33071
Stock 1000Can Ship Immediately
$ 3.65
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.22°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-17D-51-C3-R0 Thermal - Heat Sinks Application Field and Working Principle

Thermal - Heat Sinks are an important component of any electronic circuitry meant for cooling down the running processor or other devices. ATS-17D-51-C3-R0 Thermal - Heat Sinks is designed to remove excess heat from the circuits and this allows the processor to run at its optimum temperature. With the help of the thermal heat sinks, the processor can now run smoother and more efficiently since the important part of the circuit is kept at a reduced temperature.

What are ATS-17D-51-C3-R0 Thermal - Heat Sinks?

ATS-17D-51-C3-R0 Thermal - Heat Sinks are designed to dissipate heat away from the processor or other valuable components by conduction of heat. It is made up of an Aluminum or Copper heat sink and a fan is attached to the top. The fan is responsible for the dissipation of heat from the surface and will extract the heat into the surroundings. The heat sinks are designed to maximize the surface area with metal fins and other device to maximize the rate of heat transfer so that the processor or valuable components can maintain its normal operating temperature.

Application Field and Working Principle of ATS-17D-51-C3-R0 Thermal Heat Sinks

ATS-17D-51-C3-R0 Thermal - Heat Sinks are widely used in the industrial, commercial and consumer applications. Heat sinks are generally used in the power electronics or in any component or circuit which generates excess heat due to increased current consumption. Heat sinks are designed to absorb and dissipate the heat from the surface by conducting it through the special metal fins or plates which are spread out over the surface. Thus the heat can be quickly dissipated into the atmosphere without creating any hot spots and damage to the equipment. It is also very important in case of high power electronic components because the heat dissipation is essential to ensure its proper operation.

The working principle of ATS-17D-51-C3-R0 Thermal - Heat Sinks is that when the device or processor starts the heat will start to build up due to increased current consumption. As the temperature increases, the cooling fan will start to spin and it will draw the hot air away from the surface while the metal fins or plates will be conducting the heat away from the surface. This process will be continuing until the temperature is below the desired safe level and the processor or device can enjoy a peaceful existence.

Conclusion

All in all, ATS-17D-51-C3-R0 Thermal - Heat Sinks are an important part of any electronic circuit, as it helps to maintain the temperature and reduce the chances of any damage to the components. These heat sinks are widely used in consumer, commercial and industrial applications, to make sure the processor or device operates optimally. It is important to follow the user manual and use the correct thermal heat sink for the specific processor or device, in order to ensure maximum efficiency.

The specific data is subject to PDF, and the above content is for reference

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