| Allicdata Part #: | ATS-17D-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-17D-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17D-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are thermal components used to passively exchange and manage heat, while dissipating it away from sensitive components. ATS-17D-65-C3-R0 is a type of Heat Sink, typically used in the embedded computing systems for computers, remote data-centers, and industrial production applications. This specific type of Heat Sink is commonly used to prevent thermal related system failures and to provide thermal protection of metal- and plastic-enclosed electronic units.
The ATS-17D-65-C3-R0 Heat Sink features a unique design that includes a fan integrated compact aluminum housing and coordinated fins. The aluminum housing and fins are specially designed to dissipate heat quickly and evenly. This ensures that the electronic equipment and sensitive components within the housing are protected from overheating and thermal degradation.
The integrated fan is constructed using high-quality branded components, and is designed to provide directional cooling of the electronic unit. The fan is thermally interlocked to the heating components to ensure optimum cooling performance. The fan is capable of delivering air at high velocities, which enables the heat sink to dissipate its heat quickly and efficiently.
The ATS-17D-65-C3-R0 Heat Sink features the patented heat pipe technology, which assists with the transfer of released heat away from the components. The heat pipe design facilitates efficient heat dissipation by directing the heat away from the component, instead of depending on air circulation to dissipate the heat away from the unit. This allows for a significant reduction in system heating, while also reducing the risk of component damage due to heating issues.
The ATS-17D-65-C3-R0 Heat Sink is suitable for a wide range of remote data-centers and industrial applications. Its ingenious design and efficient heat pipe technology make it the ideal solution for embedded computers applications. In addition, the fan and integrated fins help ensure temperature stability and healthy operation of the computer and related components.
The ATS-17D-65-C3-R0 Heat Sink is an excellent choice for embedded computers applications, providing highly efficient heat dissipation and temperature stability, which in turn helps maintain system reliability and reduce the risk of failure due to overheating. Its unique design and thermal interlocking fan ensure optimum cooling and performance for remote data-center and industrial applications.
The specific data is subject to PDF, and the above content is for reference