ATS-17D-79-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17D-79-C3-R0-ND

Manufacturer Part#:

ATS-17D-79-C3-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17D-79-C3-R0 datasheetATS-17D-79-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.55°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-17D-79-C3-R0 is an advanced thermal heat sink module used in various situations to manage ambient temperature and conduct the heat released from a device to the surrounding environment. The device is often used in high-efficiency computer systems such as industrial automation, computer cooling, and other cooling or temperature-control applications. The device is designed to maintain temperatures within an optimal range and to dissipate the heat from the device quickly and effectively.

The ATS-17D-79-C3-R0 is based on a passive heat sink design. This means that it does not use an external power source to move the heat away from the device, but instead adds material to the environment through which the heat is distributed. The device is composed of a metal base, a fin array, a thermal interface material, and an air gap. The metal base acts as a heat spreader, spreading the heat evenly across the fins. A thermal interface material, such as silicone grease, is used between the fin array and the device to improve thermal conductivity. The air gap between the fins and the device allows air to flow more easily, which helps dissipate the heat.

Each fin in the array has a large surface area, which helps to increase the rate of heat transfer away from the device. The fin array also increases the amount of air that can flow across it, giving the device a larger surface area for dissipation. The air gap between the fins and the device also helps to maximize the surface area available and further increase the effectiveness of the device.

The ATS-17D-79-C3-R0 is an effective and reliable thermal heat sink for use in high-efficiency computer systems. It is designed to help dissipate the heat away from the device quickly and efficiently, and to maintain temperatures within an optimum range. The device is made up of a metal base, a fin array, a thermal interface material, and an air gap, which all work together to distribute and manage heat effectively. Its large fin array ensures maximum cooling and heat dissipation, while its air gap helps improve thermal performance. The ATS-17D-79-C3-R0 is highly efficient and cost-effective, making it a great choice for cooling and temperature control applications.

The specific data is subject to PDF, and the above content is for reference

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