| Allicdata Part #: | ATS-17E-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-17E-02-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a key component for providing an efficient cooling solution in many applications. The ATS-17E-02-C3-R0 is a type of heat sink specifically designed for cooling electronic components. It is both cost-effective and reliable compared to other solutions, and the ability to quickly transfer heat away from components makes it a popular choice for many applications.
The typical body of the ATS-17E-02-C3-R0 consists of a copper base plate and five aluminum fins that attach to the copper base by thermal silicone grease. Copper is used as the base material due to its excellent thermal conductivity properties – and the fins, which are spaced equally by 5mm for increased cooling efficiency, further optimize the heat dissipation process. It is important to ensure the fins are regularly kept clean to avoid dust and debris accumulation.
The ATS-17E-02-C3-R0 is designed to have an optimized air flow, which helps promote heat transfer from its surface. This is done by taking advantage of air\'s natural convection process in order to draw even more heat away from the source. Additionally, the ATS-17E-02-C3-R0 features a uniquely designed two piece assembly system – a base plate connected with heat sink fins, achieved through screws, clamps or clips. This helps ensure that the fins are held in place securely and tightly, and that the connection between the two pieces remain intact, even when subjected to vibrations.
There are several application fields for the ATS-17E-02-C3-R0 - the most common ones being computer and electrical electronics. The ATS-17E-02-C3-R0 makes an ideal choice in these environments for cooling both the electronic components and the enclosure that houses them, as its thermal efficiency keeps components consistently within their respective operating temperatures. This thermally optimized heat sink also finds use in the automotive industry, where reliable and effective cooling is a necessity for the longevity of electronic components in vehicles.
In conclusion, the ATS-17E-02-C3-R0 can be a great addition to many applications – it is a dependable and cost efficient source of cooling for electronic components, due to its optimized air flow and design. The thermally optimized heat sink also provides protection for electronic components in extreme conditions, ensuring their longevity and reliability in the long run.
The specific data is subject to PDF, and the above content is for reference