| Allicdata Part #: | ATS-17E-05-C1-R0-ND |
| Manufacturer Part#: |
ATS-17E-05-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-05-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-17E-05-C1-R0 is a thermoelectric module designed for efficient heat sink applications. It features a compact design and superior performance, making it an ideal choice for customers who require an efficient cooling system. The ATS-17E-05-C1-R0 is suitable for industrial or commercial applications, as well as laboratory or research experiments.
Design and Materials
The ATS-17E-05-C1-R0 is a compact thermoelectric thermal module consisting of a heat sink, a heat spreader, and a cooling fan. The heat sink is made from extruded aluminum with a plates included to maximize contact with the chip. The heat spreader is made from high-conductivity copper with a thermally conductive adhesive for optimal thermal transfer. The cooling fan is powered by a top-of-the-line fan motor for increased efficiency and a longer life.
Working Principle
This thermoelectric device works on the Peltier effect, which states that if two different metals are connected together by two junctions, current flow through the two junctions will create a temperature gradient between the two metals. When one junction is heated and the other cooled, heat is transferred from one junction to the other.
In the ATS-17E-05-C1-R0, the heat is dissipated from the junction on the heat sink side and transferred to the junction on the fan side. The fan then cools the cooled metal, transferring the heat away from the device. The cooler that is used in the ATS-17E-05-C1-R0 also helps to increase the rate of heat transfer and dissipate the heat more efficiently, allowing for faster cooling of the device.
Application Field
The ATS-17E-05-C1-R0 is particularly suitable for applications where there is limited space and fast and efficient cooling is necessary. Typical applications that would benefit from the ATS-17E-05-C1-R0 thermal module include industrial and military applications, such as data centers, high-speed computers, and automated production lines, as well as scientific laboratory and research experiments.
The ATS-17E-05-C1-R0 is also suitable for power electronics applications, such as solar cells and battery charging. By utilizing the thermoelectric properties of the module, heat can be dissipated from the device more efficiently, allowing for a higher power rating and better reliability.
Conclusion
The ATS-17E-05-C1-R0 is a highly efficient thermoelectric thermal module designed for heat sink applications. Its superior performance and compact design make it ideal for industrial and commercial applications and laboratory and research experiments that require an efficient cooling system. It works on the Peltier effect and is capable of dissipating heat from the device faster, allowing for increased power rating and reliability.
The specific data is subject to PDF, and the above content is for reference