ATS-17E-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17E-10-C3-R0-ND

Manufacturer Part#:

ATS-17E-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17E-10-C3-R0 datasheetATS-17E-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are a major part of electronic cooling and are used for pre-packaged, pre-manufactured industrial cooling applications. The ATS-17E-10-C3-R0 is one of the most popular heat sinks used globally. It is an aluminum copper heat sink designed for low power utilization, heat dissipation and maximum thermal performance.

The ATS-17E-10-C3-R0 heat sink is designed with a number of features to maximize its effectiveness. The aluminum layer is designed to provide excellent heat transfer performance; it dissipates heat evenly and quickly, while the copper layer ensures efficient heat dissipation. The fins are arranged in a stacked fashion to increase air convection, while the fin tips have a textured surface for additional heat dissipation. The base material is made of anodized aluminum, which provides increased durability.

The ATS-17E-10-C3-R0 thermal-heat sink is commonly used in industrial applications such as electronics cooling, medical and telecom equipments, automotive electronics, and renewable energy applications. It is also popularly used in small computer systems, and many other applications where space is of prime importance.

The ATS-17E-10-C3-R0 thermal-heat sink works on the principle of forced-air convection where hot air naturally rises due to its lower density. This process creates a low pressure area at the top of the heat sink, which causes the surrounding cooler air to move towards it and extract the heat away from the base of the heat sink. This air movement is enhanced by the fins of the heat sink itself, allowing for an efficient dissipation of heat.

The ATS-17E-10-C3-R0 thermal-heat sink has many advantages, including its low power utilization, high thermal performance and improved air movement to dissipate heat efficiently. It is also highly reliable and has an extended lifespan as compared to other thermal-heat sinks due to its anodized aluminum base material. It is an ideal choice for applications where space is of key importance and energy efficiency is a crucial factor.

The ATS-17E-10-C3-R0 Thermal-heat sink is a popular choice for many industrial and energy-management applications that require reliable cooling and maximum thermal performance. Its anodized aluminum base and low power utilization make it a great choice for those seeking an efficient and cost-effective cooling solution.

The specific data is subject to PDF, and the above content is for reference

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