| Allicdata Part #: | ATS-17E-108-C3-R1-ND |
| Manufacturer Part#: |
ATS-17E-108-C3-R1 |
| Price: | $ 4.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-108-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.48812 |
| 30 +: | $ 4.23864 |
| 50 +: | $ 3.98929 |
| 100 +: | $ 3.73993 |
| 250 +: | $ 3.49061 |
| 500 +: | $ 3.24127 |
| 1000 +: | $ 3.17894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are an important thermal management device used in many electronic applications. Heat Sinks are used to transfer heat from the components of an electronic device by dissipating or controlling the heat produced by the component. ATS-17E-108-C3-R1 is a thermal - heat sink which is used in many applications.
ATS-17E-108-C3-R1 is an extruded heat sink that is designed for maximum thermal performance. It has a patented design that produces higher thermal performance than traditional heatsinks. This heat sink has a unique multi-fin design which makes it capable of dissipating more heat than other heat sinks in its class. It has a base of aluminum alloy which has been designed to increase the surface area for maximum thermal transfer.
The ATS-17E-108-C3-R1 has a thermal resistance of 0.8°C/W, making it an excellent choice for applications that require high thermal performance and low junction temperatures. This heat sink can be used for power semiconductor devices such as IGBTs, MOSFETs, Power Discrete resistors and Diodes, and will work with a variety of mounting methods such as spring clips, screws, or push-pins.
The ATS-17E-108-C3-R1 heat sink is also designed to provide high static load capabilities of up to 7.0kg. Due to its low thermal resistance value and high static load capabilities, this heat sink can be used in a variety of applications.
The ATS-17E-108-C3-R1 heat sink has a unique working principle. It is designed with a thermal conduction pad which allows the heat to travel quickly through the heat sink. The fins of this heat sink are designed in order to move the maximum amount of air across them. This design maximizes the amount of heat that is transferred away from the device. The thermal conduction pad helps to reduce the temperature of the power semiconductor devices while the fins provide the proper air flow to dissipate the remaining heat. This design ensures the device will be able to function at its maximum potential given the correct environment.
In conclusion, the ATS-17E-108-C3-R1 heat sink is a cost effective device which offers great thermal performance and reliable operation. It is designed for use in applications that require high thermal performance and low junction temperatures. This heat sink is the perfect solution for high powered power semiconductor devices, making it an ideal choice for many applications.
The specific data is subject to PDF, and the above content is for reference