| Allicdata Part #: | ATS-17E-111-C1-R1-ND |
| Manufacturer Part#: |
ATS-17E-111-C1-R1 |
| Price: | $ 5.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-111-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.90455 |
| 30 +: | $ 4.63176 |
| 50 +: | $ 4.35935 |
| 100 +: | $ 4.08694 |
| 250 +: | $ 3.81448 |
| 500 +: | $ 3.54201 |
| 1000 +: | $ 3.47390 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that use thermal conduction, or the transfer of heat, in order to dissipate or remove heat generated by a component or device. Heat sinks are commonly used in consumer electronics, computers, and other electronic devices. The ATS-17E-111-C1-R1 heat sink is a compact heat sink designed for cooling wide temperature range of temperature-sensitive devices such as capacitors, regulators, or motor controllers.
The ATS-17E-111-C1-R1 is a passive cooling product that can dissipate a large amount of heat using its large surface area. It is designed to be used with air to air or air to water thermal management products, and its high-efficiency fin design allows it to dissipate a maximum amount of heat. The ATS-17E-111-C1-R1 is made of aluminum with a black anodized finish and has a thermal resistance of 0.74°C/W. This product is designed to be used for cooling temperatures between -20°C and +105°C.
The working principle of the ATS-17E-111-C1-R1 is based on the convection of air or liquid on its surface due to temperature gradients. When the heat sink is exposed to a heat source, heat is transferred to the finned surface through conduction. As the surface area increases, thermal gradients are established on the surfaces of the fins. The air or liquid that flows through the air passages is heated and cooled as it touches the finned surface. Heat energy is then dissipated from the heat sink through convection, removing the heat generated from the component and keeping the temperature of the device in a safe and acceptable range.
The ATS-17E-111-C1-R1 is ideal for applications that require high cooling performance with minimal envelope size. It is an ideal solution for cooling temperature-sensitive devices such as FPGAs, ASICs, drivers, and regulators. It is also ideal for applications with limited space, such as in embedded designs or instrumentation. In addition, it is suitable for applications that require multiple heat sinks, such as those found in high performance electronics.
The ATS-17E-111-C1-R1 is a reliable and cost-effective solution for cooling temperature-sensitive devices. It is a versatile solution that can be used in a variety of applications, from industrial to consumer electronics. Its high-efficiency fin design and thermal resistance ensure optimal cooling performance and reliability. The ATS-17E-111-C1-R1 is an ideal choice for applications that require high cooling performance and a compact design.
The specific data is subject to PDF, and the above content is for reference