| Allicdata Part #: | ATS-17E-14-C3-R0-ND |
| Manufacturer Part#: |
ATS-17E-14-C3-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-14-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.74787 |
| 30 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential for controlling thermal performance in any electronic system. Heat sink technology is designed to dissipate heat and maximize system uptime across a variety of critical applications, such as in systems running in harsh environments and/or at high power levels.ATS-17E-14-C3-R0 is a series of heat sinks designed to provide dependable, efficient cooling in small yet power-dense application areas. This series offers a cost-effective solution through features such as scalability, light-weight construction and thermal mass.The ATS-17E-14-C3-R0 series has been designed to perform optimally in servers, industrial equipment, automotive electronics and other high-performance electronic systems. It features a unique modular design for scalability according to application-specific needs. The series achieves its enhanced thermal capacity through a combination of an advanced fin layout and an optimized frame structure. This combination results in efficient surface area activation and advanced heat transfer capability.The assembly of the cooling system is a simple two-step process of mounting the device and connecting it to the system. Supporting components, such as ducting, fans, etc. may be installed as required.The ATS-17E-14-C3-R0 works on the principle of thermodynamics, where heat is absorbed and dissipated through the air exchange cycle between the heat sink and the ambient air. Heat is absorbed from the environment and transferred to the heat sink by conduction, convection, and radiation. The heated air is then activated by the fan and is forced out of the system through the ducting. As the air passes through, it takes away a significant portion of the heat from the heat sink, reducing the temperature.In summary, the ATS-17E-14-C3-R0 series offers a comprehensive range of thermal solutions for countless application areas. It is an extremely efficient and reliable solution ensuring dependable thermal performance and ensuring uptime for your systems.
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