ATS-17E-16-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS28852-ND

Manufacturer Part#:

ATS-17E-16-C2-R0

Price: $ 4.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17E-16-C2-R0 datasheetATS-17E-16-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.05090
10 +: $ 3.94443
25 +: $ 3.72506
50 +: $ 3.50608
100 +: $ 3.28690
250 +: $ 3.06777
500 +: $ 2.84864
1000 +: $ 2.79387
Stock 1000Can Ship Immediately
$ 4.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.08°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are essential for electronic devices to maintain optimum performance and avoid damage caused by excessive heat build up. Heat sinks are an effective way to dissipate the heat by providing additional surface are for conduction or natural convection. ATS-17E-16-C2-R0 is a specially designed heat sink featuring a low profile design and high thermal conductivity. This article explains the application field and working principle of this product.

Application Field

ATS-17E-16-C2-R0 is an aluminum-finned heat sink designed for passive cooling of medium- to high-powered devices. It has a low profile design and provides a good balance between thermal dissipation and weight. The product is suitable for applications like power transistors, power diodes, power MOSFETs and voltage regulators. It is designed to be used in liquid immersion cooling systems as well as thermoelectric cooling systems.

Features

The product features a unique design that provides excellent thermal conductivity and heat dissipation. The fins of this heat sink are constructed from aluminum and are designed to provide a large surface area to dissipate the heat. The fin design also provides turbulence that helps increase thermal performance. In addition, this product features an integrated thermal pad which helps ensure optimal heat transfer.

Working Principle

The working principle of ATS-17E-16-C2-R0 is relatively simple. When the heat generated by the device is absorbed by the heat sink, the heat is transferred through the fins, which then dissipates it into the atmosphere. The thermal pad at the bottom of the heat sink also helps optimize the heat transfer. The natural convection and the fins provide a constant flow of air over the surface that helps dissipate heat.

Advantages

The combination of features makes ATS-17E-16-C2-R0 a great choice for cooling applications. It offers a low profile design which helps reduce the weight of the device and makes it easier to mount in tight spaces. In addition, the fin design provides improved air turbulence which helps enhance the thermal performance of the heat sink. The integrated thermal pad helps ensure optimum heat transfer, and the product also has a corrosion-resistant finish.

Conclusion

Heat sinks are an essential part of any thermal management system, and ATS-17E-16-C2-R0 is an ideal choice for applications that require low profile and high thermal conductivity. This product is designed to provide excellent heat dissipation and a suitable balance between weight and performance. It features an integrated thermal pad and an aluminum-finned design to ensure optimal heat transfer.

The specific data is subject to PDF, and the above content is for reference

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