| Allicdata Part #: | ATS-17E-169-C3-R0-ND |
| Manufacturer Part#: |
ATS-17E-169-C3-R0 |
| Price: | $ 3.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-169-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.24576 |
| 30 +: | $ 3.15777 |
| 50 +: | $ 2.98229 |
| 100 +: | $ 2.80690 |
| 250 +: | $ 2.63146 |
| 500 +: | $ 2.54374 |
| 1000 +: | $ 2.28059 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-17E-169-C3-R0 is a type of thermal heat sink, which consists of two basic components: a radiating material and a heat pipe. It is primarily used to transfer heat away from a surface in order to reduce its temperature. The efficiency of this type of heat sink is dependent on a variety of factors such as the material from which it is made, the design of the radiating material and the heat pipe, as well as the environment in which it is used.
Applications of the ATS-17E-169-C3-R0
The ATS-17E-169-C3-R0 thermal heat sink is used in applications that require high-intensity cooling, such as those that involve high power electronic components, laser diodes, and LED lights. It is also often used in the automotive industry, in order to protect sensitive hardware from over-heating. Additionally, this heat sink can be deployed in consumer electronics applications, such as computers, tablets, and smartphones, where it helps maintain optimal temperatures while components are in operation.
The Working Principle of the ATS-17E-169-C3-R0
The ATS-17E-169-C3-R0 heat sink functions by collecting heat from its radiation material and transferring it away from the surface. The heat is then absorbed by the heat pipe, which is composed of a metal material that is designed to distribute heat evenly. This process is known as thermal dissipation, which is essentially the process by which heat is conducted away from a surface. The heat pipe, which is attached to the radiating material, is responsible for transferring the heat away from the source and is usually composed of materials such as copper, aluminum, or steel. The material of the heat pipe used in the ATS-17E-169-C3-R0 is copper. Its higher thermal conductivity serves to effectively disperse the heat away from the heat pipe, thus protecting the device from overheating.
How Does the ATS-17E-169-C3-R0 Ensure Optimal Performance?
The ATS-17E-169-C3-R0 heat sink is designed to provide optimal cooling performance in a variety of conditions. This is accomplished through the use of multiple materials, including the copper heat pipe and radiating material. It also features a low-profile design, which helps to maximize the surface-to-heat transfer efficiency. Additionally, the heat sink is outfitted with multiple fins that are designed to increase the air-flow around the device, which helps to dissipate heat more quickly and efficiently.
Conclusion
The ATS-17E-169-C3-R0 is a type of thermal heat sink that is used to transfer heat away from a surface, in order to reduce its temperature. This type of heat sink is composed of two components: a radiating material and a heat pipe, which help to efficiently disperse heat away from the device. Additionally, the ATS-17E-169-C3-R0 boasts a low-profile design and multiple fins that provide enhanced cooling performance. All of these features help to ensure that the device remains protected from overheating and functions optimally in a variety of conditions.
The specific data is subject to PDF, and the above content is for reference