| Allicdata Part #: | ATS-17E-181-C1-R0-ND |
| Manufacturer Part#: |
ATS-17E-181-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-181-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-17E-181-C1-R0 is a thermal-heat sink, which is used in applications where active cooling is required in order to maintain a steady temperature. Thermal-heat sinks are used in a variety of applications, such as electronic equipment, industrial machinery, computer, automotive and aerospace applications. In these applications, thermal-heat sinks help keep components cool by dissipating heat away from components and into the environment.
In its simplest form, a thermal-heat sink is a metal plate or block of metal with a number of metal fins which allow air to pass through them. The metal fins provide a large surface area which allows the heat generated by the components to be quickly and efficiently transferred away. The fins also help to increase the cooling effect of the thermal-heat sink by dissipating the heat into the surrounding environment. In addition, the fins can also be designed to direct the airflow around components and improve their cooling efficiency even further.
The ATS-17E-181-C1-R0 is designed to provide efficient cooling in a wide range of applications. It has a metal case which houses a number of fins which help to dissipate the heat into the environment. It is designed to be mounted directly onto a PCB or other substrate, and is suitable for use in high temperatures. It is also designed with a number of features that help to improve performance and reliability, including a plate-fin finish to help optimize thermal performance, solderability and corrosion resistance.
The ATS-17E-181-C1-R0 is designed to work with a variety of components, including CPUs, heat sinks, chipsets, capacitors, power supply modules and other heat sources. It uses a combination of air flow and conduction to effectively cool the components. Airflow is generated due to the air passing through the fins, while conduction ensures that heat is transferred from the component to the thermal-heat sink, allowing for maximum efficiency and reliability. The ATS-17E-181-C1-R0 offers a wide range of features that help to ensure optimal cooling performance and reliability, such as a rugged construction and a wide variety of mounting options.
The ATS-17E-181-C1-R0 is a proven and reliable thermal-heat sink that offers a cost-effective solution for a wide range of applications. It is designed to provide efficient cooling in high-temperature environments, while also offering a range of features that help to optimize performance and reliability. The combination of air and conduction cooling ensures optimal performance, while the rugged construction and a wide variety of mounting options make it easy to install and use. The ATS-17E-181-C1-R0 is a great choice for applications that require reliable and efficient thermal-heat sink solutions.
The specific data is subject to PDF, and the above content is for reference