| Allicdata Part #: | ATS-17E-202-C1-R0-ND |
| Manufacturer Part#: |
ATS-17E-202-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X6MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-202-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.80°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks – ATS-17E-202-C1-R0 Application Field and Working Principle
A thermal management system is a critical component of any modern electronic equipment. Heat Transfer is one of the most commonly used techniques to prevent heat buildup and maintain a system’s optimal operating temperature. Heat Sinks are one of the most commonly used devices in this process. The ATS-17E-202-C1-R0 Heat Sink, in particular, is one of the most efficient heat sinks available in the market today.
A heat sink is a device that can absorb and dissipate heat to allow better thermal management. Heat sinks are typically composed of multiple fins attached to a base, offering ample surface area for thermal transfer. The fins serve as points of contact to allow the thermal energy to escape. The base is typically designed to provide a stable area of support for the fins, allowing them to stay in place and effectively transfer the thermal energy. The ATS-17E-202-C1-R0 Heat Sink is made of high-quality aluminum which offers superior heating performance and enhanced thermal stability.
The ATS-17E-202-C1-R0 Heat Sink is designed to be used in a wide variety of electronic applications. Its design makes it suitable for use in routers, modems, power supplies, and other cabinets. It is designed to provide an optimal air flow, making it ideal for use in confined areas and tight spaces. With its strategic design, the ATS-17E-202-C1-R0 promises to efficiently dissipate the generated heat and keep the component within the specified operating temperature range.
The ATS-17E-202-C1-R0 Heat Sink boasts an impressive performance record. For its size, it has an impressive heat dissipation capability of up to 28W. This makes it suitable for use in high-powered systems that generate more heat than average. The thermal resistance measures at 0.72°C/W, making it one of the lowest in its category. The Maximum Air Flow is rated at 4.6 CFM, allowing for optimal cooling performance.
The ATS-17E-202-C1-R0 Heat Sink is designed with an array of fan-induced air tunnels to dissipate the thermal energy away from the component. The tunnels act as a channel for the air to flow through and quickly cool the component. At its base, the ATS-17E-202-C1-R0 contains a series of copper heat plates with extended deformation area. These heat plates are designed to increase efficiency and allow for maximum insulation and heat dissipation.
The ATS-17E-202-C1-R0 Heat Sink is a vital tool for any electronic component, especially when it comes to systems that generate significant amounts of heat. With its superior heat dissipation capabilities and superior thermal resistance, the ATS-17E-202-C1-R0 Heat Sink ensures optimal performance and reliability. The copper heat plates and fan-induced air tunnels provide optimal heat transfer to help maintain the system’s temperature range and prolong its life.
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