| Allicdata Part #: | ATS28911-ND |
| Manufacturer Part#: |
ATS-17E-24-C2-R0 |
| Price: | $ 5.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-24-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.37390 |
| 10 +: | $ 5.22837 |
| 25 +: | $ 4.93769 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-17E-24-C2-R0 Thermal - Heat Sinks Application Field and Working Principle
Thermal - Heat Sinks are devices used to transfer, regulate, and dissipate thermal energy to help protect devices used in a variety of applications including computers, medical machines, communication systems, and automotive systems.
ATS-17E-24-C2-R0 is a specially designed thermal management solution utilizing a combination of a base model air fin cooler and an optimally designed top plate heat sink. It is a screw-mounted Peltier or PTFE thermoelectric cooling module and can be used in a variety of low-power applications in various environmental conditions.
The ATS-17E-24-C2-R0 series utilizes an air fin cooler as its basic component. This air fin cooler has a two-stage system with an optimized air flow and fan design to dissipate a large amount of heat. The cooling fins are constructed from a high-quality extruded aluminum profile and are available in various sizes.
In addition to the air fin cooler, the ATS-17E-24-C2-R0 series also includes a top plate heat sink that is attached to the upper surface of the module. The top plate heat sink has a greater cooling surface area and can transfer more heat than other thermal solutions. This heat sink can also be optimized for different power levels to maximize cooling efficiency.
The ATS-17E-24-C2-R0 series utilizes a variety of technologies, including Peltier or PTFE thermoelectric cooling technology, to reduce the temperature of components. This technology, coupled with the air fin cooler and the top plate heat sink, creates an effective thermal management solution that can help protect the lifespan of components. Additionally, the ATS-17E-24-C2-R0 series also offers a range of features, such as a temperature sensor, anti-shock protection, and low-power LEDs.
The ATS-17E-24-C2-R0 series is ideal for a range of applications, including computing, medical, communications, automotive, and industrial systems. The ATS-17E-24-C2-R0 series has been designed to provide an efficient, reliable, and cost effective solution for cooling components in a variety of different environmental conditions.
The ATS-17E-24-C2-R0 series is composed of a base model air fin cooler and an optimally designed top plate heat sink. This combination works together to transfer, regulate, and dissipate thermal energy as efficiently as possible. The air fin cooler helps to dissipate the generated heat, while the top plate heat sink helps to transfer the heat to the air fin. The Peltier or PTFE thermoelectric cooling used in the module also helps regulate the temperature of components.
Overall, the ATS-17E-24-C2-R0 series utilizes a combination of technologies and components to create an effective thermal management solution that helps to protect the lifespan of components in many applications. From computing to automotive systems, this thermal management solution is capable of providing reliable and cost effective cooling in a variety of different environmental conditions.
The specific data is subject to PDF, and the above content is for reference