ATS-17E-33-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17E-33-C1-R0-ND

Manufacturer Part#:

ATS-17E-33-C1-R0

Price: $ 5.41
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X17.78MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17E-33-C1-R0 datasheetATS-17E-33-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.86990
30 +: $ 4.59900
50 +: $ 4.32860
100 +: $ 4.05802
250 +: $ 3.78748
500 +: $ 3.51695
1000 +: $ 3.44932
Stock 1000Can Ship Immediately
$ 5.41
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 17.40°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-17E-33-C1-R0 heat sink is one of the most popular and effective thermal cooling mechanisms available today. It is used in a variety of industries and applications, from consumer electronics like laptops and computers to military and aerospace applications. The ATS-17E-33-C1-R0 is designed for maximum heat dissipation, making it an ideal choice for high performance and operation in extreme thermal environments.

The ATS-17E-33-C1-R0 heat sink is a passive heat transfer device, meaning it does not require an external power source to operate. Its primary purpose is to dissipate heat away from electronics or devices in order to maintain their performance and reliability. This is accomplished by providing a large surface area for the heat to be absorbed and dissipated away from the device.

The ATS-17E-33-C1-R0 heat sink consists of two main components: a low-profile base plate and a large fin stack. The base plate acts as a foundation and provides structural stability, while the fin stack provides a large surface area to absorb and dissipate heat. The fins are made of a material with a high thermal conductivity which helps to quickly draw heat away from the device. Additionally, the fins are also designed with small curved apertures that help to further enhance the heat transfer rate by turbulence.

The ATS-17E-33-C1-R0 heat sink is used in a variety of applications ranging from consumer electronics and telecommunications to military and aerospace. In consumer electronic applications, the ATS-17E-33-C1-R0 helps to prevent heat accumulation due to long-term use of laptops and computers, thereby ensuring reliable performance. The heat sink is also commonly used in military and aerospace applications, where its ability to dissipate heat at a faster rate helps to keep electronic components from overheating during operation.

The ATS-17E-33-C1-R0 heat sink is an effective and reliable thermal cooling mechanism and is used in a variety of different applications. Its robust design and superior thermal performance make it an ideal choice for efficient heat dissipation in extreme thermal environments. The ATS-17E-33-C1-R0 heat sink is an excellent choice for any application or industry where thermal management is an important factor.

The specific data is subject to PDF, and the above content is for reference

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