| Allicdata Part #: | ATS-17E-48-C1-R0-ND |
| Manufacturer Part#: |
ATS-17E-48-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-48-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to keep electrical devices such as CPUs and GPUs from overheating. ATS-17E-48-C1-R0 is a type of heat sink with multiple special features for thermal management. It has a low height profile and is made of aluminum alloy material for better heat dissipation. In this article, we will discuss the application fields and working principle of ATS-17E-48-C1-R0.
Application fields
The ATS-17E-48-C1-R0 is primarily used for cooling electronic devices, such as CPUs, GPUs, graphics cards, RAM modules, motherboards, etc. It is also suitable for applications in which the operating temperatures of the components are expected to be very high, such as in high performance workstation computers or data centers. In addition, because of its low profile design, it can be used in narrow or confined spaces, making it a great choice for 1U servers or compact PC builds.
Working principle
This thermal heatsink uses a combination of thermal conduction and convection to cool any device. The aluminum alloy material has excellent thermal conductivity that helps with quick heat transfer away from the source. Its curved design creates an airflow area, which helps with convection cooling. This airflow further increases when the heatsink is mounted properly. Additionally, the integrated copper slug offers heat transfer enhancement properties, further decreasing the temperature of the device.
The integrated heat fin also serves to increase the overall heat dissipation area. Its multiple fins are specially designed to efficiently move the heat away from the heat source. Lastly, the fan design helps to cool down the heat fins quickly, further reducing the temperature of the device.
Conclusion
In conclusion, the ATS-17E-48-C1-R0 is a great choice for thermal management when considering a CPU, GPU, motherboard, graphics card, or RAM module. Its unique design is optimized to quickly dissipate the heat away from the source, allowing your device to stay cool even under intense workloads. Thanks to its low profile design, it can even be used in narrow or even 1U servers and compact PCs. Therefore, if you are looking for an effective thermal management solution, then the ATS-17E-48-C1-R0 is a great choice.
The specific data is subject to PDF, and the above content is for reference