| Allicdata Part #: | ATS-17E-55-C3-R0-ND |
| Manufacturer Part#: |
ATS-17E-55-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17E-55-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important aspects of any electrical system. The proper dissipation of heat generated by electrical components is critical to the performance, reliability, and longevity of the system. Heat sinks are one of the most common and vital thermal management components used in electrical applications. Heat sinks are designed to provide a thermal path from the component or assembly to the surrounding environment, and are used to maximize heat transfer and reduce temperature gradients.
The ATS-17E-55-C3-R0 is a heat sink designed to dissipate heat from multiple thermal sources. This heat sink is made of extruded aluminum and is designed to provide optimal performance in applications where heat needs to be structured away from electronic components. The ATS-17E-55-C3-R0 is designed with a tapered fin structure to improve heat dissipation. The fins are designed to be of a specific angle to maximize its surface area and to ensure the maximum thermal transfer between the components and the surrounding environment. The heat sink also has a natural convection air current which helps to dissipate heat away from the components and keep them from overheating.
The ATS-17E-55-C3-R0 is a highly efficient heat sink designed for multiple thermal sources in desktop computers, servers, industrial applications, and other electronic systems. This heat sink is a great choice for operations that require high airflow and optimal performance. It can be used in applications such as cooling CPUs and graphics cards, cooling hard drives, cooling power supplies and other subsystems, and providing power supply Passive cooling.
The ATS-17E-55-C3-R0 is designed with a fin array to maximize its surface area, and its fin pitch is designed to minimize airflow resistance. The fin pitch is designed to create a relatively large difference between its leading and trailing edges, which is important for maximizing its heat dissipation capacity. Its fin array is also designed to be slightly offset, to reduce dead air space and to create a uniform airflow across the fins. The heat sink also has a built-in fan, which can be used to direct the airflow in specific directions and to increase the heat transfer rate.
The ATS-17E-55-C3-R0 is an effective heat sink that helps to keep electrical systems from overheating and improves their reliability and longevity. This heat sink is designed to provide optimal performance in a wide range of applications, and is a great choice for anyone looking for an efficient way to manage the heat generated by their electrical systems.
The specific data is subject to PDF, and the above content is for reference