ATS-17E-97-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS28972-ND

Manufacturer Part#:

ATS-17E-97-C2-R0

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17E-97-C2-R0 datasheetATS-17E-97-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.93750
10 +: $ 3.82851
25 +: $ 3.61595
50 +: $ 3.40326
100 +: $ 3.19051
250 +: $ 2.97781
500 +: $ 2.76511
1000 +: $ 2.71193
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 20.30°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are essential components in today\'s high-tech world, as heat is an undesirable by-product of most electronic processes. A properly designed thermal-heat sink is essential to achieving maximum application performance, as it controls temperatures and the rate of heat transfer. ATS-17E-97-C2-R0 is a high-performance, low-power thermal-heat sink module with outstanding thermal characteristics. This module offers superior thermal stability and improved noise reduction, providing the best possible application performance in demanding environments.

The ATS-17E-97-C2-R0 is a highly efficient, advanced thermal-heat sink designed for high-end thermal performance. It utilizes a unique high-density aluminum extrusion to help dissipate heat quickly and evenly. The extrusion is constructed with an intricate array of fins that increase surface area and improves heat dissipation. This thermal-heat sink also features an optimized air flow system, which helps to reduce air turbulence and improves heat transfer efficiency.

The ATS-17E-97-C2-R0 can be used in a wide range of applications, from high-performance PCs, gaming systems, and home electronics, to industrial and medical electronic applications. This thermal-heat sink is also ideal for applications needing improved thermal dynamic and improved noise reduction, such as construction and outdoor LED sign systems. This module is highly reliable and energy-efficient, helping to reduce power consumption and costs for the user.

The working principle of the ATS-17E-97-C2-R0 thermal-heat sink is based on a combination of convection and conduction cooling. The system works by transferring heat from the source component to the aluminum fins of the heat sink, where it is transferred to the surrounding air. The thermal-heat sink is designed to maximize airflow and thermal conductivity, which is essential for efficient heat transfer. As air passes through the aluminum fins, heat is dissipated evenly and quickly, helping to keep the application running at optimal temperatures.

The ATS-17E-97-C2-R0 thermal-heat sink module has been designed and engineered for maximum performance. Its unique aluminum extrusion helps to dissipate heat quickly and evenly, while its optimized air flow system helps to reduce noise levels and improve overall performance. This thermal-heat sink is perfect for high-performance applications, offering improved thermal management and lower power consumption.

The specific data is subject to PDF, and the above content is for reference

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