ATS-17F-02-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS28976-ND

Manufacturer Part#:

ATS-17F-02-C2-R0

Price: $ 3.69
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17F-02-C2-R0 datasheetATS-17F-02-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.35790
10 +: $ 3.26907
25 +: $ 3.18100
50 +: $ 3.00422
100 +: $ 2.82744
250 +: $ 2.65074
500 +: $ 2.56237
1000 +: $ 2.29730
Stock 1000Can Ship Immediately
$ 3.69
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.32°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-17F-02-C2-R0 Application Field and Working Principle

Thermal - Heat Sinks is a type of electronic device made of metal or plastic designed to help dissipate the thermal energy generated by high-powered circuits or electronic components. Thermal - Heat Sinks have a higher rate of heat dissipation than surrounding materials, allowing for better cooling and preventing thermal runaway. ATS-17F-02-C2-R0 is a high quality thermal - heatsink with multiple uses in both residential and business settings.

The ATS-17F-02-C2-R0 is a medium-sized aluminum sink designed to be used in both air and liquid cooling applications. It is available in a variety of mounting options, making it suitable for tight spaces and low clearance heights. The fins are tightly spaced to ensure maximum heat dissipation and its large copper base ensures that the device stays cool even under extreme temperatures. The device is rated to dissipate up to 200 Watts of power, providing ample cooling power for a variety of components.

The ATS-17F-02-C2-R0 is often used for cooling CPUs, GPUs, and other components in computer networks. The device easily attaches to a motherboard using integrated mounting brackets, allowing for easy installation and replacement. The aluminum fins and copper base ensure good heat dissipation even when the computer is running at full capacity. The device can also be used for cooling induction motors and other operating equipment, as its large fins provide better drafting of air and faster cooling.

The ATS-17F-02-C2-R0 uses a basic heat-sink, using a combination of aluminum fins on top of a copper base. Heat is transferred from the CPU or other component to the aluminum fins, where the heat is dissipated in the air. The copper base also helps to transfer heat from the CPU or other component, but it is not as effective as an aluminum base due to the higher thermal resistance. The copper base helps to prevent heat from dissipating too quickly, preventing overheating and ensuring long-term stability of any application.

The ATS-17F-02-C2-R0 is available in both air and liquid cooling versions, depending on the cooling requirements of each application. For air cooling, the device attaches to the top of the chassis via mounted screws. The fins are then used to draw the heat away from the CPU or other component, ensuring maximum cooling. For liquid cooling, the device attaches to tubing systems, through which liquid is passed to cool the device and keep the temperature stable. Both air and liquid cooling systems help to provide maximum cooling and stability for any application.

The ATS-17F-02-C2-R0 is an excellent example of a high-quality thermal - heatsink. Its aluminum fins and copper base provide excellent heat dissipation, helping to keep the temperature of CPUs and other components stable and safe. Its compatibility with both air and liquid cooling systems makes it ideal for both residential and business settings. The device is easy to install and replace, making it a great choice for any computer network or operating equipment.

The specific data is subject to PDF, and the above content is for reference

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