ATS-17F-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17F-10-C1-R0-ND

Manufacturer Part#:

ATS-17F-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17F-10-C1-R0 datasheetATS-17F-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is critical for optimal performance of electronic devices. By controlling the temperature of device components, thermal management ensures that electronic devices can withstand the stresses of high temperatures and will not malfunction due to excessive heat. Heat sinks are an important component of thermal management. They are designed to dissipate heat from electronic devices, regulating their temperature and ensuring optimal performance.

The ATS-17F-10-C1-R0 Thermal Heat Sink is a high-performance heat sink designed for use in various electronic and industrial applications. It is a two-phase, three-piece aluminum fin heat exchanger that features open fins and an efficient aluminum base V-clip. The thermal heat sink\'s three-piece design allows for quick installation and removal and its open fins provide good heat dissipation over a wide temperature range.

The ATS-17F-10-C1-R0\'s main application field is in the electronic and industrial thermal management markets. It is ideal for a variety of applications including but not limited to computer systems, LED lighting, telecommunications, and automotive systems. The thermal heat sink is designed to dissipate heat from electronic components and ensure their optimal performance over a wide range of temperatures and operating conditions.

The ATS-17F-10-C1-R0\'s thermal management working principle is based on the process of convection. Convection is a method of heat transfer in which a hot substance transfers its heat to a colder substance by the physical movement of air or fluid. As heat is generated by electronic devices, it is transferred to the thermal heat sink. The thermal heat sink\'s fins then dissipate the heat into the surrounding air, simultaneously cooling the electronic devices and ensuring their optimal performance.

The ATS-17F-10-C1-R0\'s thermal management process is enhanced by its thick aluminum base for superior heat transfer. Additionally, its fine aluminum fins allow for more effective dissipation of heat over a wide range of operating temperatures. The thermal heat sink also features a high Thermal Resistance (Rth) that ensures optimal performance of the electronic devices and a low Noise Emission (Nep) that limits the noise output of the device.

In addition to its thermal management functionality, the ATS-17F-10-C1-R0 Thermal Heat Sink also offers a number of aesthetic benefits. The product features a lightweight and compact design, making it easy to integrate into new applications. Additionally, the product\'s attractive pin fin design and anodized aluminum finish add a touch of sophistication to any application.

The ATS-17F-10-C1-R0 Thermal Heat Sink is a high-quality, attractive, and efficient thermal management solution for a variety of electronic and industrial applications. Its convection-based thermal management process ensures efficient heat dissipation and optimal performance of the device, while its attractive design adds a touch of sophistication to any application.

The specific data is subject to PDF, and the above content is for reference

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