ATS-17F-104-C3-R1

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Thermal - Heat Sinks are devices designed to transfer heat away from sensitive components into the surrounding environment for cooling, and are a crucial part of any heat-management system. In modern electronics, thermal management has become ever more difficult due to increases in power and higher frequencies. ATS-17F-104-C3-R1 is one such example of a thermal - heatsink.

ATS-17F-104-C3-R1 is a high performance heatsink, and an exemplary product of Phonsatech’s Power-bit Series. Due to its high performance, heat dissipation, and sleek design, it is an ideal choice for a wide range of applications. The ATS-17F-104-C3-R1 features an improved version of Phonsatech’s innovative thermal design, which ensures maximum heat dissipation for any given power output. This work is enhanced by a combination of clever design features, such as the incorporation of multiple heat-spreader fins and strategically placed gaps between the fins.

The ATS-17F-104-C3-R1 has an aluminum alloy frame that is designed to create an efficient thermal bridge between the heat sink and the heat-conductive surface. The aluminum alloy is light, strong and highly thermally conductive, which helps to efficiently transfer heat away from the heat-conductive surface to the fins. The design also features a uniform cross section that allows for more efficient air flow and cooler temperatures.

At the core of the ATS-17F-104-C3-R1 is its cooling chamber, which helps to dissipate heat away from the sensitive components. The cooling chamber is filled with thermal-conductive fins that are designed to increase the heat transfer rate from the components to the fins. Furthermore, the fins are also designed to help power components to move heat more efficiently, allowing for faster cooling and, in turn, greater power efficiency.

In addition to its efficient thermal management system, the ATS-17F-104-C3-R1 also features an acoustic-dampening construction that helps to minimize acoustic noise. The structure features a design that incorporates a baffle system to reduce the transfer of sound waves, allowing the heatsink to operate silently.

When it comes to applications, the ATS-17F-104-C3-R1 is well suited to a wide range of applications, including LED display, automotive applications, server and data center applications, telecom applications and general cooling. It is also ideal for a wide range of power components, including microprocessors, field-programmable gate arrays, switches, active filters and amplifiers.

In conclusion, the ATS-17F-104-C3-R1 is a high performance heatsink designed for a wide range of applications. It offers efficient thermal management and acoustic dampening, as well as a sleek design that makes it an ideal choice for a variety of power components and applications. It is a testament to the quality and innovation behind the Power-bit Series of products from Phonsatech.

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