| Allicdata Part #: | ATS29001-ND |
| Manufacturer Part#: |
ATS-17F-115-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-115-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat produced from a variety of electronic components must be dissipated in order for them to work properly. Heat sinks are one of the components that can effectively do this job. The ATS-17F-115-C2-R0 heat sink is a popular thermal management solution for cooling a wide range of devices. This article will discuss the working principle and application of this heat sink.
The ATS-17F-115-C2-R0 is an integrated heat sink consisting of several different parts. It is composed of a copper base, soldered connections, anodized aluminum heat dispersing fins, springs, and metal working parts. All of these components work together to create a highly efficient, lightweight heat sink.
At the core of the ATS-17F-115-C2-R0 is the copper base. Copper is an excellent conductor of heat and provides the main foundation for the heat dissipation in the heat sink. When a thermal component is connected to the copper base, heat is transferred from the component to the copper. The copper then conducts this heat away from the component and outwards, traveling up the vertical fins. As the fins are naturally anodized Aluminum, the heat travels quickly up the fins dissipating it into the air.
Along the sidewalls of each fin are soldered connections. These connections help to transfer the heat from the copper base to the fins faster. They also strengthen and stabilize the fin structure ensuring that the fins do not warp or bend when in operation.
At the top of the fins are a series of springs. The springs are driven by a non-contact flexure mechanism which allows for the heat to be evenly transferred from the copper conducting plate to the fins. This helps to ensure that heat is dispersed evenly and that there are no hot spots in the structure.
The metal work components of the ATS-17F-115-C2-R0 heat sink are made up of anodized aluminum fasteners that hold the metal components of the heat sink together. They also help to improve the overall thermal performance of the unit by serving as a heat shield.
So what are some of the application fields of this heat sink? In general, it is an ideal thermal management solution for cooling down high performance electronic components such as CPUs, GPUs, and memory modules. It is also widely used in industrial applications, such as automotive and aerospace, as a means of dissipating heat generated from an engine or a system of components.
The ATS-17F-115-C2-R0 heat sink is a highly efficient thermal management solution that is capable of dissipating heat quickly and efficiently. With its copper base and anodized aluminum heat dispersers, this heat sink can realize maximum heat dissipation in an instant.
In conclusion, the ATS-17F-115-C2-R0 heat sink is a great thermal management solution for a number of applications, from consumer electronic devices to high performance systems. With its effective heat transfer technology, the ATS-17F-115-C2-R0 can ensure that the components it was designed to cool remain at optimal operating temperatures for peak performance.
The specific data is subject to PDF, and the above content is for reference