| Allicdata Part #: | ATS-17F-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-17F-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that absorb and dissipate heat from electronic components, usually located within the chassis of a computer or other electronic device. Without a heat sink, the electronics inside of the device would become too hot, leading to the destruction of the device. As a result, many electronics manufacturers include heat sinks as part of their product to ensure it does not become too hot to operate. The ATS-17F-117-C1-R0 is a special type of heat sink specifically designed to dissipate excess heat from embedded electronics within tight spaces.
Application Field
The ATS-17F-117-C1-R0 is designed to dissipate thermal energy from embedded electronics in very tight spaces. It is specifically designed to fit into 1U rack mount applications or any space that needs a low profile heat sink. It is designed to be used in processes that require high temperatures such as medical equipment, automotive systems, or any other application that requires an efficient and effective cooling solution for embedded electronics. The heat sink is also designed to be a low profile so it can fit in tight locations.
Working Principle
The ATS-17F-117-C1-R0 is a forced convection heat sink. This means that it relies on a fan or other mechanical device to move air across the fins of the sink to dissipate the heat. The fan is designed to pull in air from surrounding environment and move it across the fins of the heat sink so that the heat dissipates out of the fins quite effectively. The air is then exhausted out of the device so that it does not re-circulate inside the same device. The fan also works to maintain a constant air flow for optimal heat dissipation.
The ATS-17F-117-C1-R0 is designed to be highly efficient when it comes to the dissipation of thermal energy. The fins of the heat sink are designed to maximize the surface area that the air can flow over. This helps to quickly dissipate heat without putting too much strain on the fan or electronics. Additionally, the fins are designed with a specific shape that helps to draw the air across the fins for an even more efficient cooling process.
The ATS-17F-117-C1-R0 heat sink is designed to be used with a fanless cooling system as well. This is known as a natural convection heat sink. In this system, the heat sink relies on natural convection to move air over the fins. Natural convection will occur if the ambient temperature is greater than the temperature of the heat sink fins. This means that the surrounding air will be drawn in over the fins and the cooler air at the bottom of the sink will be pushed out. The system is efficient, but it is not as efficient as a forced convection system.
The ATS-17F-117-C1-R0 heat sink is a high-performance heat sink specifically designed to dissipate heat from embedded electronics in tight spaces. Its forced convection design relies on a fan to effectively move air across the fins so that heat can be quickly dissipated from the device. The fins are designed to maximize the surface area for efficient heat dissipation, and its low profile design allows it to fit into tight spaces. It is an ideal solution for applications that require high temperatures, and it can even be used with a fanless cooling system for more efficient cooling.
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