| Allicdata Part #: | ATS-17F-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-17F-12-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-17F-12-C3-R0 Thermal-Heat Sink is one of the most efficient and reliable heat sinks available on the market today. It is designed to effectively dissipate heat generated by electronic components and devices. The ATS-17F-12-C3-R0 is widely used in medical, industrial, and aerospace applications.
The ATS-17F-12-C3-R0 works by convection. Its design enables it to effectively transport heat energy from the source to the heat sink. The ATS-17F-12-C3-R0 does this by creating a vacuum inside the heat sink that helps to draw the heat away from the source. This vacuum is created by using fans and vents that allow air to flow over the heat sink and move the heat away from the source.
The ATS-17F-12-C3-R0 is designed to be used in a variety of environments, from indoor to outdoor. It is suitable for use in both wet and dry conditions, and can be installed in areas with limited space. The ATS-17F-12-C3-R0 has an operating temperature range of -20°C to +125°C.
The ATS-17F-12-C3-R0 is composed of high-grade aluminum which helps it to quickly dissipate heat. It is also designed with a low thermal resistance to ensure that heat is evenly dissipated from the source, instead of accumulating in the heat sink. The ATS-17F-12-C3-R0 also features a finned structure that helps to maximize the surface area exposed to the air, which further aids heat dissipation.
The ATS-17F-12-C3-R0 has a wide variety of applications including but not limited to CPUs, laser printers, memory modules, GPUs, and other electronic components. For more demanding applications, the ATS-17F-12-C3-R0 can be used with a forced air cooling system to keep temperatures within a comfortable range. The ATS-17F-12-C3-R0 is also compatible with a variety of mounting systems and brackets, which makes it easy to install in any environment.
The ATS-17F-12-C3-R0 is a highly effective and reliable thermal-heat sink. It is designed to quickly and efficiently dissipate heat away from electronic components, helping to keep them functioning at optimal temperatures. The ATS-17F-12-C3-R0 can be used in a wide variety of applications, making it a great choice for both medical, industrial, and aerospace applications.
The specific data is subject to PDF, and the above content is for reference