ATS-17F-15-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.52°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-17F-15-C3-R0

The ATS-17F-15-C3-R0 is a type of thermal-heat sink specifically designed to provide efficient thermal management for electronic and optical equipment. It can be used in a range of applications from automotive to aerospace, medical to industrial, and communications to military. The heat sink utilizes a unique patented design which combines copper fins, heat sink base, and clip technology to provide superior heat dissipation while also providing cost-effective thermal management solutions.

Application Fields of ATS-17F-15-C3-R0

The ATS-17F-15-C3-R0 is applicable to a wide range of applications, including LED lighting, communications, medical imaging, automotive, commercial video, military, aerospace, defense, and computer systems. It is also ideal for power supplies, motor control systems, and other high-power applications. In addition, its small size makes it highly suitable and efficient for use in confined spaces.

Working Principle of ATS-17F-15-C3-R0

The working principle of the ATS-17F-15-C3-R0 can be explained from the perspective of heat transfer. Heat is transferred from the source by conduction, radiation, and convection. The copper fins of the heat sink provide highly efficient thermal conductivity, while the heat sink base provides an effective surface area for the dissipation of heat from the equipment. The clip technology allows the heat sink to be securely mounted onto the equipment, and the air vents around the fins provide efficient convective heat transfer. All of this combines to give the ATS-17F-15-C3-R0 superior heat dissipation, resulting in improved performance and reliability of the equipment.

Conclusion

The ATS-17F-15-C3-R0 is a high-performance thermal-heat sink designed to provide superior heat dissipation for a wide range of electronic and optical equipment. Its patented design combines copper fins, heat sink base, and clip technology to provide efficient thermal conductivity and convection. This makes it highly suitable for use in some of the most demanding applications, such as LED lighting, medical imaging, automotive, and defense. The ATS-17F-15-C3-R0 is a reliable and cost-effective solution for thermal management of electronic and optical equipment.

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