| Allicdata Part #: | ATS-17F-153-C3-R0-ND |
| Manufacturer Part#: |
ATS-17F-153-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-153-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks Article
Thermal management has become an increasingly important aspect of modern electronics, due to the ever-diminishing form factor, operational complexity, and ever-increasing thermal load. Heat sinks are a key component in any thermal management solution, as they provide an effective way to dissipate heat away from sensitive components. The ATS-17F-153-C3-R0 is a thermal heat sink specifically designed for electronics with high thermal loads.
Application Field
The ATS-17F-153-C3-R0 is a large format heat sink designed for dissipating the heat generated by large electronic components. It is designed to be used in applications such as high power modems, routers, base stations, DSPs, and ASICs. The device has a 398mm x 298mm footprint, with an additional 98mm (3.8in) height. This makes it suitable for use in both rack-mounted equipment and in commercial products or systems that require large amounts of ventilation, such as industrial or server rooms.
Working Principle
The ATS-17F-153-C3-R0 is a large format heat dissipator. It works by extending the surface area of the component it is attached to, enabling the heat to spread out across a larger area than if the component were left un-extended. The large area of the finned heat-sink surface is made up of hollow aluminum fins which act as airfoils, allowing air to flow through the fins more easily, thus creating a more effective heat-transfer between the air and the heat-sink. The air-flow thru the finned surface can also be enhanced by using an airflow direction-adjusting channel, so that air is directed to the hotter zones of the heat-sink, and away from the colder areas, further improving heat transfer between the heat-sink and ambient air. The ATS-17F-153-C3-R0 also includes several adjustable support points which enable it to be securely attached to the component which it is cooling. This makes it suitable for use in a range of different applications and installations.
Conclusion
In conclusion, the ATS-17F-153-C3-R0 is a large format heat-sink designed for dissipating large amounts of heat generated by large electronic components. Its large footprint and adjustable support points make it suitable for a variety of different applications and installations. The large finned surface area enhances air-flow and cooling performance, and enables the heat to spread out efficiently. The ATS-17F-153-C3-R0 is a reliable and effective solution for efficient thermal management of large-scale electronic components.
The specific data is subject to PDF, and the above content is for reference