ATS-17F-17-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.51°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal or heat sinks are devices used to manage heat produced in electronic components like processors or power systems. The ATS-17F-17-C3-R0 is a thermal control device used to dissipate large amounts of heat generated in power systems. It was designed to increase the heat transfer rate of components and decrease the size and weight of the cooling system. This article will discuss the application field and working principle of the ATS-17F-17-C3-R0.

Application

The ATS-17F-17-C3-R0 is used in applications that require the transfer of heat from the component to the environment. It is specifically designed for cooling of computer systems, power systems, electronic components, and other components that generate a large amount of heat. It can be used in place of traditional cooling systems and can be integrated into existing systems to increase efficiency and reduce size.

Design

The ATS-17F-17-C3-R0 has an optimized design for efficient cooling. It is constructed from aluminum alloy which provides excellent thermal conductivity and durability. It features a surface with double-layer fins that are optimally arranged for high efficiency heat transfer. The fins form a high-performance airfoil shape which creates a turbulent flow within the fins. This increases the convection coefficient and reduces the temperature of the component being cooled.

Working Principle

The ATS-17F-17-C3-R0 heatsinks work in two ways. The first is heat transfer from the component to the environment. The airfoil fins help to achieve high heat transfer rates and the efficient performance. The second way is convective cooling. The fins generate a turbulent flow of air which acts to cool the component by taking away the heat generated.

Conclusion

The ATS-17F-17-C3-R0 is a reliable and efficient thermal control device for cooling of computer systems, power systems, and other components. It has an optimized design that increases the heat transfer rate of components and decreases the size and weight of the cooling system. The ATS-17F-17-C3-R0 works on both heat transfer and convective cooling principles and thus provides optimal cooling capabilities.

The specific data is subject to PDF, and the above content is for reference