ATS-17F-171-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17F-171-C1-R0-ND

Manufacturer Part#:

ATS-17F-171-C1-R0

Price: $ 3.42
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X20MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17F-171-C1-R0 datasheetATS-17F-171-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.11472
30 +: $ 3.03051
50 +: $ 2.86209
100 +: $ 2.69375
250 +: $ 2.52542
500 +: $ 2.44124
1000 +: $ 2.18870
Stock 1000Can Ship Immediately
$ 3.42
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.28°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are an essential component in regulating the temperatures of electrical equipment. This article examines the ATS-17F-171-C1-R0 heat sink and its application field and working principle, offering a better understanding of how this device operates to keep electrical components cool.

ATS-17F-171-C1-R0 is a high-efficiency heat sink designed for high thermal conductivity in a more rigid and rigid-bodied form. It is constructed from aluminum that is anodized to create a metallic layer that works to trap and absorb heat that is emitted from a variety of electronic components. The top of the heat sink is designed with a circular or rectangular hole pattern that allows air to pass freely between the fins of the heat sink in order to dissipate heat from the surface.

ATS-17F-171-C1-R0 is an effective cooling solution for applications requiring high temperature operation, such as data centers, server rooms, networking equipment, and more. It is also equipped with a mounting clip so that it can be installed quickly and easily into any type of enclosure or chassis. The fanless design of the heat sink also allows it to be used in environments where there is limited airflow and high levels of air pressure.

The working principle of ATS-17F-171-C1-R0 is based on the concept of convection. This is where heated air rises and is replaced by cooler air. The cooler air passes through the fin of the heat sink, absorbing the heat and transferring it away from the components that the heat sink is cooling. This process is known as convective cooling and it is the most efficient and reliable way of keeping electrical components operating at safe temperatures.

The application field for ATS-17F-171-C1-R0 is wide and varied. This heat sink can be used in any application where reliability, efficiency, and superior thermal conductivity are required. It is perfect for medical equipment, avionics, mobile devices, industrial applications, and more. It can even be used in high altitude environments, where high temperatures are present, because the design of the heat sink allows it to be completely sealed and airtight. This ensures optimal performance.

Overall, ATS-17F-171-C1-R0 is an ideal heat sink for managing temperatures in a wide variety of applications. Its ability to effectively dissipate heat in high temperatures, along with its user-friendly design, make it a great choice for any type of environment.

The specific data is subject to PDF, and the above content is for reference

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