| Allicdata Part #: | ATS-17F-177-C1-R0-ND |
| Manufacturer Part#: |
ATS-17F-177-C1-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-177-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19788 |
| 30 +: | $ 3.11157 |
| 50 +: | $ 2.93857 |
| 100 +: | $ 2.76576 |
| 250 +: | $ 2.59291 |
| 500 +: | $ 2.50647 |
| 1000 +: | $ 2.24717 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management and heat removal have become increasingly important in modern electronics. One of the tools used to manage heat is the ATS-17F-177-C1-R0 heat sink. This device is designed to work with passive cooling systems and transfers heat from a component to the environment with minimal disturbance to the surrounding components. This article will discuss the ATS-17F-177-C1-R0 application field and working principle.
The ATS-17F-177-C1-R0 is a combination of a heat sink and fan, allowing it to efficiently dissipate heat away from the electronics. This heat-removal device is commonly used in medical equipment, telecommunications systems, high-end consumer electronics, handheld electronics, and more. The ATS-17F-177-C1-R0 is also designed for use in environments with a wide range of operating temperatures, meaning it can be used in a variety of applications.
The ATS-17F-177-C1-R0 heat sink is designed to help maintain optimal temperatures in electronics. This is done by dissipating heat from the component to the environment more efficiently than a traditional passive heat sink. The device utilizes a set of thermally conductive materials such as aluminum and copper to quickly dissipate heat. As an added layer of protection, the ATS-17F-177-C1-R0 also includes a fan to help maximize cooling efficiency.
In order for the ATS-17F-177-C1-R0 to effectively dissipate heat, it must be installed and used correctly. When installing the device, it must be placed in an area with enough room to accommodate the fan. The device is then attached to the component using the provided mounting clips. Once the device is in place, the fan is then connected to the power source and turned on.
The operation of the ATS-17F-177-C1-R0 heat sink is fairly straightforward. As the fan circulates air, it pulls heat away from the component and transfers it to the surrounding environment. This process simultaneously eliminates any existing hot spots in the electronic device while preventing the generated heat from traveling to other components and damaging them. The device is also designed to adjust its fan speed based on the temperature of the device, ensuring it remains at a safe temperature.
The ATS-17F-177-C1-R0 heat sink is a great tool for managing heat in modern electronics. It is designed to efficiently transfer heat from a component to the environment with minimal disturbance to the surrounding components. This device can be used in a variety of applications, from medical equipment to high-end consumer electronics. With the addition of a fan for additional cooling power, the ATS-17F-177-C1-R0 can help ensure optimal temperatures are maintained so your device runs as efficiently as possible.
The specific data is subject to PDF, and the above content is for reference