| Allicdata Part #: | ATS-17F-181-C3-R0-ND |
| Manufacturer Part#: |
ATS-17F-181-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-181-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important in modern electronic applications, and one of the most important components for such applications is the thermal heat sink. The ATS-17F-181-C3-R0 is a popular thermal heat sink designed for high-power applications. This article will discuss the features, applications, and working principles of the ATS-17F-181-C3-R0.
The ATS-17F-181-C3-R0 is a high-performance thermal heat sink designed for high-power applications. This aluminum alloy heat sink features a 180 mm × 150 mm × 56 mm package and a large size-to-power ratio of 22mm²/W. The fins have a special process treatment to improve stillness, ease of installation, and anti-vibration performance. The heat sink is also equipped with 3M adhesive tape for easy installation and optimal heat transfer. The ATS-17F-181-C3-R0 is RoHS compliant and UL approved.
The ATS-17F-181-C3-R0 is suitable for a variety of applications, including power systems, LED lighting, automotive systems, aerospace, defense, and medical applications. It is also suitable for high-power applications such as high-power DC-DC components, high-power switch mode power supplies (SMPS), and high-power amplifiers. As it is lightweight and compact, the ATS-17F-181-C3-R0 is also suitable for portable devices and mobile applications.
Together with a good design, the ATS-17F-181-C3-R0 provides high heat dissipation efficiency with its advanced thermal management features. The heat sink is designed to transfer the heat generated by the electronic device away from the component and dissipate it into the environment. It features a unique shape with a combination of radiating fins and fit-and-fill fin alignment, which are designed to reduce thermal resistance. The heat sink is also equipped with a three-dimensional heat pipe structure to improve heat conductivity.
The ATS-17F-181-C3-R0 is capable of dissipating up to 300 W of heat even at an ambient temperature of 70°C. The optimized structure of the heat sink and the heat pipe design allow for efficient cooling of components while ensuring minimal noise levels. The heat sink is also designed to reduce system temperatures and reduce thermal cycling. Additionally, the heat pipe and the fin structure are designed to improve airflow in confined spaces, making the ATS-17F-181-C3-R0 suitable for low-profile applications.
In conclusion, the ATS-17F-181-C3-R0 is a high-performance thermal heat sink designed for high-power applications such as switch mode power supplies, high-power amplifiers, and LED lighting. This aluminum alloy heat sink features a 180mm × 150mm × 56mm package and a large size-to-power ratio of 22mm²/W. It is designed with a unique configuration of radiating fins and fit-and-fill fin alignment to provide efficient thermal management with minimal noise levels. The ATS-17F-181-C3-R0 is also suitable for low-profile applications due to its optimized structure and its heat pipe design.
The specific data is subject to PDF, and the above content is for reference