| Allicdata Part #: | ATS29083-ND |
| Manufacturer Part#: |
ATS-17F-19-C2-R0 |
| Price: | $ 4.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-19-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.36590 |
| 10 +: | $ 4.24494 |
| 25 +: | $ 4.00907 |
| 50 +: | $ 3.77332 |
| 100 +: | $ 3.53751 |
| 250 +: | $ 3.30168 |
| 500 +: | $ 3.06585 |
| 1000 +: | $ 3.00689 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is rapidly becoming an important component, as electronic devices become faster and more complex due to using advanced semiconductor technology. Heat sinks, as its name implies, is a type of material made of metal and is used to cool down the heat generated by electronic devices and keep them operating properly. ATS-17F-19-C2-R0 is an example of an advanced thermal-heat sink that’s used in consumer and professional markets.
ATS-17F-19-C2-R0 application field covers both server and desktop systems, providing reliable and efficient thermal heat dissipation. It is suitable for use in those areas with limited and restricted airflow, such as those being used in small form factor computers. The thermal resistance of the ATS-17F-19-C2-R0 is 0.11°C/W, so it can effectively dissipate heat quickly.
The ATS-17F-19-C2-R0 works by improving the efficiency of transferring heat from the CPU or other integrated circuit packages to the environment, preventing them from becoming too hot. It is made of stainless steel, aluminum and other materials to provide high-performance heat exchange between the hot surface and heat sink. This helps the system remain cool, stable and efficient.
The construction of the ATS-17F-19-C2-R0 consists of radiating fins that are stacked perpendicularly to the airflow. This design makes the device more efficient in transferring heat than other heat sink designs as the fins are evenly distributed, providing an effective heat-dissipation system. The fins are also designed to be easier to assemble and install, making them easier to build and maintain.
The ATS-17F-19-C2-R0 working principle is based on the natural convection of air over the heat sink. When a computer system is operating, hot air is generated from the components and then drawn up the heat sink, where it is quickly dissipated away from the device, allowing it to remain cool. This process helps increase the air flow to the components and ensures the system remains stable and running at optimum performance.
The ATS-17F-19-C2-R0 is also designed to have an integrated fan, which further increases its cooling ability. The fan draws in air from the surrounding environment and forces it over the heatsink to disperse heat quickly and efficiently. This helps reduce the amount of heat generated by the electronic components and improve their performance.
In conclusion, the ATS-17F-19-C2-R0 is a highly efficient thermal heat sink ideal for use in both consumer and professional systems. Its radiating fins effectively disperse and dissipate heat, and its integrated fan improves cooling ability. The device is easy to assemble and install, and its working principle is based on the natural convection of air over the heatsink.
The specific data is subject to PDF, and the above content is for reference