| Allicdata Part #: | ATS-17F-193-C3-R0-ND |
| Manufacturer Part#: |
ATS-17F-193-C3-R0 |
| Price: | $ 3.30 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-17F-193-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.99565 |
| 30 +: | $ 2.91480 |
| 50 +: | $ 2.75285 |
| 100 +: | $ 2.59094 |
| 250 +: | $ 2.42903 |
| 500 +: | $ 2.34806 |
| 1000 +: | $ 2.10516 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are essential components capable of transferring heat from a device, such as an integrated circuit, to its surrounding environment. Skinned heat sinks are thermally efficient, highly reliable and offer superior mechanical strength for robust device performance. The ATS-17F-193-C3-R0 is a heat sink designed to provide thermal management solutions to various applications.
Application Field and Working Principle
The ATS-17F-193-C3-R0 is well suited for applications that require efficient heat dissipation, such as semiconductor processing, industrial process control systems and LED lighting. It is specifically designed to dissipate heat from high-power components such as CPUs and GPUs.
This heat sink consists of an anodized, aluminum extruded body which is mechanically pressed into a fin pattern. The fin pattern can be despired to provide improved cooling performance by increasing the exposed area. The edges of the fins are radiused to reduce air turbulence and optimize the flow of air for improved performance. The fins are spaced apart to ensure adequate air flow. Additionally, a series of vents act as exhausts to evacuate hot air.
This heat sink is equipped with a heatpipe which helps to transmit the heat generated by the device to the fins. The heatpipe is made of copper with a special wick structure which allows liquid to diffuse and evaporate from the evaporator to the condenser side, resulting in efficient heat transfer.
The ATS-17F-193-C3-R0 is also designed to interface with other components. It is equipped with an integrated mounting bracket which is able to accept standard mounting hardware for external components while providing a solid, secure mounting point for the heat sink. In addition, the heat sink features a retention clip that ensures a secure attachment to the component being cooled. This ensures that the heat sink remains in position, even when subjected to thermal cycling or vibration.
To further enhance performance, the heat sink is paired with a fan which provides additional cooling. The fan provides a steady stream of air that is directed toward the fins, thus improving the transfer of heat from the device to its surroundings. The fan is designed to operate at a low noise level, making it well suited for applications that require noise reduction.
The specific data is subject to PDF, and the above content is for reference
ATS-17F-193-C3-R0 Datasheet/PDF