| Allicdata Part #: | ATS-17F-200-C1-R0-ND |
| Manufacturer Part#: |
ATS-17F-200-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-200-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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,ATS-17F-200-C1-R0 Thermal - Heat Sinks Application Field and Working Principle
Thermal - heat sinks are an important component of any electronic device, since they are responsible for dissipating heat from vital components. The ATS-17F-200-C1-R0 heat sink is a particular type of thermal-heat sink, which is designed to provide superior cooling capacity in rugged and limited space-environmental applications.
The ATS-17F-200-C1-R0 is a high efficiency extrusions heat sink that is suitable for both commercial and military applications. It is designed to provide excellent cooling in the most challenging environments. With its unique design and high quality construction, it is able to dissipate up to 200 Watts of heat with a minimum thermal resistance of 0.17 C/W.
The ATS-17F-200-C1-R0 is made from extruded aluminum, which has been optimized to maximize thermal efficiency. The fins are machined to provide optimal performance. The heat sink is designed with an enlarged fin surface area and strategically placed fins to ensure the greatest possible thermal transfer.
The ATS-17F-200-C1-R0 heat sink is designed to offer superior cooling capacity in a variety of applications, including: industrial and scientific electronics, automotive, computer, entertainment, and medical fields. It is also suitable for a wide range of temperatures from -40°C up to +75°C.
The working principle of the ATS-17F-200-C1-R0 heat sink is based on the concept of heat conduction. Heat is transferred from one medium (the component or device being cooled) to another (the aluminum fins of the heat sink) through conduction. As heat is dissipated from the device, it passes through the fins of the heat sink and is then dissipated into the surrounding air.
The efficiency of heat transfer from the device being cooled to the fins is largely due to the design of the heat sink. Its fin surface area is designed to have maximum exposure to air flow and forms an efficient heat transfer surface. The fins are also arranged strategically so that there is minimal resistance to airflow and maximum heat dissipation.
The ATS-17F-200-C1-R0 heat sink is designed to provide superior cooling capacity in a variety of applications. Its advanced design and construction make it an ideal choice for applications requiring rugged and reliable cooling solutions.
The specific data is subject to PDF, and the above content is for reference