| Allicdata Part #: | ATS-17F-26-C3-R0-ND |
| Manufacturer Part#: |
ATS-17F-26-C3-R0 |
| Price: | $ 6.90 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-26-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.21117 |
| 30 +: | $ 5.86635 |
| 50 +: | $ 5.52119 |
| 100 +: | $ 5.17614 |
| 250 +: | $ 4.83106 |
| 500 +: | $ 4.48599 |
| 1000 +: | $ 4.39972 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are key components to various types of electronic equipment and assemblies, particularly those that generate a large amount of heat. The ATS-17F-26-C3-R0 heat sink is a popular source of thermal protection and cooling for electronic components.
This particular heat sink is a three-finger design using crimped fins to increase surface area for better heat transfer. The fins are extruded through a die-cast aluminum base, which also contains a thermally conductive pad. The fins are then folded and crimped, resulting in increased surface area while maintaining a low profile profile.
The ATS-17F-26-C3-R0 is a small heat sink, measuring only 17mm x 26mm x 8.5mm. Its low profile makes it ideal for applications where space is very limited. The light weight makes it easy to install and use, while providing good thermal transfer for small components.
The primary application field for the ATS-17F-26-C3-R0 heat sink is as cooling for low-power electronic equipment. This is especially useful in products like consumer electronics, such as HDTVs and digital audio players. In these types of products, the heat from the printed circuit boards can be dissipated quickly with the aid of a heat sink.
The working principle of the ATS-17F-26-C3-R0 is based on thermodynamics. Heat is generated as electricity flows through a component and then transferred to a cooler source, such as the heat sink. By increasing the surface area of the sink, the greater ability to absorb more heat and dissipate it into the atmosphere. The air around the heat sink also acts as a thermal barrier, slowing down the process and keeping the components from overheating.
The ATS-17F-26-C3-R0 heat sink is also capable of mounting directly onto the printed circuit board, or can be mounted to an adjacent surface with the use of thermal clips. This allows for more efficient and convenient cooling solutions for products that have limited space. Additionally, the heat sink design is slim enough for use in concentrated area of electronics.
In summary, the ATS-17F-26-C3-R0 heat sink is ideal for small electronics requiring thermal protection and cooling. Its slim, low-profile design, lightweight and thermal conductivity make it an excellent choice for consumer electronics. Its versatility and mounting options give designers the flexibility to provide the best cooling solution for their product. The operating principle of the heat sink is based on thermodynamics, wherein heat is generated and then transferred to cooler sources for dispersal.
The specific data is subject to PDF, and the above content is for reference