| Allicdata Part #: | ATS-17F-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-17F-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions such as heat sinks are key components to efficiently cool and protect products from potentially damaging temperatures. ATS-17F-32-C2-R0 heat sinks are tailored using an array of advanced design principles and high-performance materials. These robust designs improve the performance and safety of the products they are applied to, as well as providing an overall cost-effective cooling solution.
The ATS-17F-32-C2-R0 is a large heat sink that features a thick base plate and multiple aluminum fins. It is designed with a slate-shaped fin pattern to minimize wind turbulence for greater cooling efficiency. The fin pattern is optimized to achieve uniform heat distribution and maximum air circulation. The heat sink also utilizes highly conductive materials, such as copper, to easily dissipate heat away from the heat source. Additionally, the various levels of fin height create a multi-dimensional airflow, further improving the thermal performance.
The ATS-17F-32-C2-R0 can be used across multiple industries thanks to its wide range of applications. Its abilities to efficiently dissipate heat makes it perfectly suited to automotive, lighting, and consumer electronics industries. In consumer electronics, the heat sink can be used in various computing devices, such as laptop computers, to effectively cool the processor. It can also be used in servers to ensure user safety and product longevity. In addition, the heat sink also provides much-needed cooling in telecommunications, telemetry, and cloud-computing applications.
The ATS-17F-32-C2-R0 has an effective thermal resistance of 0℃/W and a minimum airflow requirement of 10 CFM for best results. It is designed for 12V and 24V, and can handle power densities up to 70W/in2. The design and material quality of this heat sink have been optimized to ensure the highest grade of heat transfer. The fins are made from 6063-T5 aluminum with a film thickness of 18μm, and the baseplate is constructed from 1.00mm thick copper.
In conclusion, the ATS-17F-32-C2-R0 is an advanced heat sink solution catering to multiple industries with its wide range of applications. Its superior design and top quality materials enable it to provide maximum thermal performance and efficient heat dissipation. Its 0℃/W thermal resistance and 70W/in2 power density allows it to effectively cool devices at a much faster rate, compared to other heat sink solutions.
The specific data is subject to PDF, and the above content is for reference