| Allicdata Part #: | ATS-17F-39-C1-R0-ND |
| Manufacturer Part#: |
ATS-17F-39-C1-R0 |
| Price: | $ 5.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X5.84MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-39-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.93920 |
| 30 +: | $ 4.66473 |
| 50 +: | $ 4.39022 |
| 100 +: | $ 4.11585 |
| 250 +: | $ 3.84146 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential components for dissipating heat generated in electronics applications. They provide an efficient and effective means of radiating energy away from heat-generating components, and can be found in many electronics including computers, audio amplifiers, and automotive systems. The ATS-17F-39-C1-R0 is a popular thermal heat sink designed for use in industrial environments. This article will discuss the application fields and working principle of the ATS-17F-39-C1-R0 heat sinks.
The ATS-17F-39-C1-R0 heat sink is designed to provide a cost-effective heat dissipation solution for high-performance applications. It is a small-sized heat sink that is ideal for mounting on a printed circuit board (PCB) or ceramic-based substrate. The heat sink is constructed from aluminum and includes a series of fins designed to maximize surface area in order to maximize the thermal conductivity. This leads to a greater heat dissipation and better overall performance. The heat sink is available in various sizes and is suitable for a wide range of applications, including automotive, medical, computing, and communications.
The ATS-17F-39-C1-R0 utilizes a pin-fin design. This type of design combines thermal conduction and convection to achieve optimal heat transfer efficiency. The fins are arranged in a pattern that is designed to maximize airflow. This maximize the airflow, allowing for a greater rate of heat dissipation. The pin-fin design also allows for greater thermal conduction, resulting in a more efficient transfer of heat from the component to the heat sink.
The ATS-17F-39-C1-R0 is an advanced thermal heat sink solution that is designed for use in high-performance industrial applications. It is extremely durable and can withstand temperatures up to 150°C. The heat sink also features integrated rear support brackets, which allow for easy installation and mounting on a PCB. In addition, it is compatible with a variety of components and is easy to maintain due to its minimal size.
The ATS-17F-39-C1-R0 is ideal for use in applications such as industrial robotics, high-end consumer electronics, laptops, phone chargers, and automotive components. It is specifically designed to be robust and reliable while also offering excellent thermal performance. The heat sink is also suitable for use in a range of thermal solutions, such as active and passive cooling systems.
Overall, the ATS-17F-39-C1-R0 is an excellent thermal heat sink solution. It is designed for use in high-performance industrial applications and offers excellent thermal performance. The pin-fin design increases airflow and allows for greater thermal conduction, resulting in a more efficient transfer of heat from the component to the heat sink. The heat sink is also easy to install and maintain, making it an ideal choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference