| Allicdata Part #: | ATS-17F-62-C1-R0-ND |
| Manufacturer Part#: |
ATS-17F-62-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-62-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are an important part of all electronics, particularly those exposed to extreme temperatures. The integration of thermal management solutions into electronics systems improves their performance as well as prolonging their life. ATS-17F-62-C1-R0 is a popular thermal management solution. It is widely used in many applications and is known for its reliability and performance. In this article, we will discuss the applications and working principle of the ATS-17F-62-C1-R0 thermal management solution.
The ATS-17F-62-C1-R0 thermal management solution is a heat sink with an integrated heat pipe. It is designed to dissipate heat away from the source, such as a heatsink or processor, and spread it over the greater surface area of the heat sink. This makes it more efficient at dissipating the heat and keeps the source and surrounding components from becoming too hot. This makes the ATS-17F-62-C1-R0 an ideal choice for cooling down processors, components, or other electrical items that have a tendency to get too hot.
The ATS-17F-62-C1-R0 can be used in a variety of applications. It can be used to cool CPUs, GPUs, and other processors that generate a large amount of heat. It is also popular in industrial applications such as air conditioners, refrigerators, and other cooling systems. Additionally, the ATS-17F-62-C1-R0 is commonly used to cool components found in aerospace and automotive applications.
The working principle of the ATS-17F-62-C1-R0 is relatively simple. The heat pipe transfers the heat from the source to the heat sink. The heat pipe contains a liquid that absorbs the heat from the source, heats up, and evaporates into a gas. This gas is then drawn through the heat pipe and is released into the heat sink. The heat sink then dissipates the heat into the air or environment around it, thus cooling down the source.
The ATS-17F-62-C1-R0 thermal management solution is a reliable and efficient way to manage the thermal issues within electronic systems. It is an ideal choice for cooling and dissipating the heat that is generated by processors and other sensitive components. With a simple installation and reliable performance, this thermal management solution is a popular choice for a variety of applications. As such, ATS-17F-62-C1-R0 is an important thermal management solution that can help extend the life of electronics as well as improve their overall performance.
The specific data is subject to PDF, and the above content is for reference