| Allicdata Part #: | ATS-17F-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-17F-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in the performance and longevity of electronic components. Heat sinks are a key component of this thermal management, as they are designed to draw heat away from critical electronic components. The ATS-17F-63-C1-R0 is one such heat sink. This article will explain the ATS-17F-63-C1-R0’s application field and working principle.
Application Field
The ATS-17F-63-C1-R0 is a heat sink designed for use in applications where minimum thermal resistance is essential. The product has been designed to meet the needs of space-limited electronic applications, and is manufactured using full computer-aided design technology to ensure maximum performance and reliability. The product is made from extruded aluminum with anodized black finish, with thermal resistance between 35°C/W and 40°C/W. The ATS-17F-63-C1-R0 is ideal for applications such as air-cooled cabinets, power electronic and power management components, various other industrial and consumer application, and telecom and networking products.
Working Principle
Heat sinks are designed to transfer heat away from sensitive electronics and dissipate it into the surrounding environment. The ATS-17F-63-C1-R0 does this by allowing its fins to bring in air from outside and direct it onto the heat source. The fins act as air channels that direct air flow, which increases the surface area of the heat sink. The increase in surface area allows for a greater amount of heat to be transferred away from the heat source. The ribs of the fins also offer increased heat transfer performance by forcing the air to travel along the length of the heat sink more slowly than it would in an undisturbed environment. In addition, the anodized finish of the ATS-17F-63-C1-R0 also acts to increase the heat transfer rate between the heat sink and the heat source.
The ATS-17F-63-C1-R0 also features a thermal resistance of 35°C/W to 40°C/W, which indicates its ability to quickly transfer heat away from electronic components. This high level of thermal resistance enhances the product’s efficacy in space-limited applications and provides superior heat transfer performance.
The ATS-17F-63-C1-R0 is an ideal heat sink for applications where quick and efficient heat transfer is needed. Its application field is broad, and it is suitable for use in industrial and consumer applications as well as power electronic and power management components and telecom and networking products. Its working principle of drawing heat away from the source and dissipating it into the surrounding environment allows it to perform its duties efficiently.
The specific data is subject to PDF, and the above content is for reference