| Allicdata Part #: | ATS-17F-63-C3-R0-ND |
| Manufacturer Part#: |
ATS-17F-63-C3-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17F-63-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have various applications, one of them being the ATS-17F-63-C3-R0. It is specifically designed for high power, high heat applications. ATS-17F-63-C3-R0 employs a combination of strategically placed fins and embedded heat pipe to efficiently remove heat from the source. This product can be used in applications ranging from consumer electronics to automotive, aviation, and power generation.
The ATS-17F-63-C3-R0 is composed of a radiator and cooling fan assembly that is thermally connected to an embedded heat pipe. The heat pipe uses a liquid coolant that has a high thermal conductivity and is contained within the sealed air space acting as a thermal link between the hot and cold sides. Heat is absorbed by the liquid coolant at the hot side and transferred to the cold side through thermal contact with the heat exchange fins. The fins then dissipate the heat to the surrounding air by convection.
The ATS-17F-63-C3-R0 design allows for highly efficient cooling and requires minimal maintenance. It is designed to be mounted to both electronic components and enclosures, with mounting brackets and fasteners provided. The assembly consists of two parts, the base and the fan, which are connected by a thermal interface. The fan provides forced or convective cooling.
The advantages of the ATS-17F-63-C3-R0 heat sink are numerous. It is easy to mount, requires minimal tooling, and is cost-effective. Furthermore, it is a lightweight design has an extended service life. The combination of air and liquid cooling provided by the ATS-17F-63-C3-R0 increases cooling efficiency and enhances performance. The assembly is designed to operate quietly and is available in different sizes so that it can be used in different applications.
This heat sink is the ideal solution for applications requiring high power and high heat dissipation. The combination of air and liquid cooling provides maximum cooling efficiency, while the lightweight design and extended service life make the ATS-17F-63-C3-R0 heat sink a perfect choice for many applications.
The specific data is subject to PDF, and the above content is for reference