ATS-17G-02-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-17G-02-C3-R0-ND

Manufacturer Part#:

ATS-17G-02-C3-R0

Price: $ 3.60
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17G-02-C3-R0 datasheetATS-17G-02-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.26907
30 +: $ 3.18087
50 +: $ 3.00422
100 +: $ 2.82744
250 +: $ 2.65074
500 +: $ 2.56237
1000 +: $ 2.29730
Stock 1000Can Ship Immediately
$ 3.6
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Thermal management and dissipation are essential in many applications, especially when dealing with high power circuitry. Heat sinks provide an effective way to transfer heat away from sensitive components and help maintain the desired temperature range necessary for optimal performance.

The ATS-17G-02-C3-R0 is a type of heat sink specifically designed for high power, high-performance applications. It features an efficient thermal transfer material that is capable of dissipating up to 9 Watts of heat per square centimeter (W/cm2). This heat sink is also designed with an electrostatic discharge mechanism to protect sensitive electronic components from sparks.

One of the main benefits of this heat sink is its ability to reduce temperatures in application areas that are difficult to cool. This includes areas that are exposed to direct sunlight or where there is high ambient temperature. The heat sink also features excellent thermal conductivity, meaning it can absorb more heat than other materials with similar thickness. Its design also ensures uniform heat dissipation across the entire surface area, providing more efficient cooling than other solutions.

The working principle of the ATS-17G-02-C3-R0 heat sink is quite simple. First, heat is absorbed from the environment and processed by its efficient thermal transfer material. This causes the heat to temporarily accumulate, before it is then released through the electrostatic discharge mechanism. Finally, the dispersed heat is conducted away from the device by the heat sink, ensuring that the application operates in its desired temperature range.

Thanks to the ATS-17G-02-C3-R0 heat sink\'s efficient thermal transfer material, it is able to handle high-temperature applications without sacrificing performance. It is also able to dissipate large amounts of heat in short amounts of time, making it an ideal choice for applications where long cooling down times are not possible. Additionally, its electrostatic discharge protection helps to ensure that sensitive electronic components remain safe and secure.

The ATS-17G-02-C3-R0 heat sink is an ideal choice for a variety of applications, such as in telecom, consumer electronics, medical, automotive, and LED lighting. It is also compatible with a variety of circuit boards, allowing users to easily integrate it into almost any design. When paired with the right thermal management solution, the ATS-17G-02-C3-R0 heat sink can provide highly effective cooling for even the most demanding applications.

The specific data is subject to PDF, and the above content is for reference

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