| Allicdata Part #: | ATS-17G-114-C3-R0-ND |
| Manufacturer Part#: |
ATS-17G-114-C3-R0 |
| Price: | $ 3.47 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-114-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.15063 |
| 30 +: | $ 3.06516 |
| 50 +: | $ 2.89498 |
| 100 +: | $ 2.72462 |
| 250 +: | $ 2.55435 |
| 500 +: | $ 2.46919 |
| 1000 +: | $ 2.21376 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.53°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are designed to draw heat away from components, extend their lifespan, and improve performance. The ATS-17G-114-C3-R0 is a quality model that efficiently dissipates heat, and is well-suited for industrial and consumer applications. It features a heat-conducting aluminum base, metal pins, and a thermally conductive epoxy bond to promote efficient heat transfer and dissipate heat quickly and continuously.
The ATS-17G-114-C3-R0 is especially useful in devices that require intense processing and generate a lot of heat. It can help ensure that temperatures remain within safe levels, creating a stable environment that allows your device to operate at full capacity while high-usage parts are kept cool.
The heat sink’s efficient design ensures that it requires minimal energy for heat dissipation, translating into lower power usage. The sleek design is also unobtrusive, so it can easily be integrated into your device without taking up a lot of space. The durability of the ATS-17G-114-C3-R0 also makes it a great option, as it is unlikely to fail in extreme environmental conditions.
The ATS-17G-114-C3-R0 is also incredibly easy to work with. It is lightweight, yet able to dissipate up to 13.4W of heat, making it a great option for low-profile and compact devices with limited space. The small size also helps minimize the number of additional components that need to be included, such as fans or heat-spreaders.
The ATS-17G-114-C3-R0 also has excellent thermal performance, meaning that it can quickly transfer heat away from the device and extend its operational life. The thermal efficiency of the device is due to its high quality materials, as well as its good contact with the component it is cooling. This ensures that no hotspots are generated and that temperatures remain consistent.
The ATS-17G-114-C3-R0 is the ideal choice for those looking for an effective and efficient thermal solution. It offers durability, ease of integration, excellent thermal performance, and low energy usage, making it a great option for industrial and consumer applications.
The specific data is subject to PDF, and the above content is for reference