| Allicdata Part #: | ATS-17G-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-17G-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to dissipate heat generated by electronic components such as CPUs and transistors, allowing them to run more efficiently. The ATS-17G-115-C1-R0 heat sink is a fin heat sink developed by Advanced Thermal Solutions, Inc. (ATS). This heat sink is designed to be low profile, lightweight, and easy to install, making it ideal for electronic applications where size and weight are important factors.
The ATS-17G-115-C1-R0 is a versatile heat sink that can be used in a variety of applications. It is suitable for cooling microprocessors, IGBTs, MOSFETs, transistors, voltage regulators, and other components. It is also ideal for high-speed applications and can be used in both single and multi-rail systems. The heat sink features a fin geometry that promotes efficient heat dissipation due to the turbulence created when air passes through its passages. Its low-profile design allows it to fit into tight spaces, making it perfect for use in compact electronic devices and systems.
The ATS-17G-115-C1-R0 is a highly efficient heat sink. Its aluminum construction acts as an efficient heat conductor, allowing it to quickly dissipate heat away from its point of origin. Its fin shape increases the total surface area exposed to the air, which increases the rate at which heat can be transferred away from the component. Additionally, the ATS-17G-115-C1-R0 features an adhesive tape backing for easy installation onto flat surfaces. The mounting screws can be quickly adjusted for a secure fit.
To further increase the rate of heat dissipation, the ATS-17G-115-C1-R0 can be used in conjunction with a passive heatsink. The passive heatsink acts as an additional heat sink, drawing heat away from the component and cooling it further. This arrangement can be beneficial for applications where the component is generating a large amount of heat.
The ATS-17G-115-C1-R0 heat sink is an efficient, lightweight, and versatile cooling solution for a variety of applications. Its fin geometry and low-profile design make it ideal for tight spaces, while its aluminum construction and tape backing make it quick and easy to install. Its superior performance ensures that it can keep components running at optimal temperatures, improving performance and reliability. With its combination of performance and convenience, the ATS-17G-115-C1-R0 is an optimal choice for cooling electronic components.
The specific data is subject to PDF, and the above content is for reference