| Allicdata Part #: | ATS-17G-122-C3-R0-ND |
| Manufacturer Part#: |
ATS-17G-122-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-122-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technologies, such as heat sinks, are essential components in modern electronics. Heat sinks are designed to dissipate heat from a device quickly and effectively to ensure its longevity. The ATS-17G-122-C3-R0 heat sink is a great example of a modern, efficient thermal management device.
The ATS-17G-122-C3-R0 heat sink is made of a high-efficiency aluminum alloy to provide outstanding thermal conductivity. It is a direct contact, low-profile heat sink that uses thermal tape to maximize contact with the heat-generating component. The aluminum alloy profile is designed with slotted fins and a vertical vane geometry to increase surface area and thereby boost heat dissipation efficiency.
Due to its design features, the ATS-17G-122-C3-R0 offers superior heat dissipation performance compared to many other heat sinks. It is designed to work with flat, power-dissipating components like CPUs and can be mounted on the component with adhesive tape or screws. Moreover, its low profile design makes it a perfect choice for applications where height and weight are critical factors.
The ATS-17G-122-C3-R0 was designed for reliable performance in demanding environments. It is designed for use in temperatures ranging from -20°C to +90°C (-4°F to +194°F), and is rated for loadings of up to 7 kg (15 lbs). This makes it ideal for applications such as high power LED lighting, server cooling, and telecommunications.
The ATS-17G-122-C3-R0 excels in thermal conductivity, efficiency, and durability. These attributes make it an ideal choice for cooling components that require high power and reliability. The heat sink mounts directly to the surface of components to maximize heat transfer and dissipate heat more quickly. The precision-slotted fins and vertical vane geometry also help to increase surface area and thus further improve heat dissipation efficiency.
The ATS-17G-122-C3-R0 is a high-performance heat sink designed for use in demanding electronics applications. It is made of aluminum alloy for superior thermal conductivity and features a direct contact, low-profile design for improved performance and reliability. Its slotted fins and vertical vane geometry help to maximize surface area for improved heat dissipation, while its low profile makes it a great choice for applications where height and weight are critical factors.
The specific data is subject to PDF, and the above content is for reference