ATS-17G-132-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-17G-132-C1-R0-ND

Manufacturer Part#:

ATS-17G-132-C1-R0

Price: $ 4.37
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-17G-132-C1-R0 datasheetATS-17G-132-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.93246
30 +: $ 3.71427
50 +: $ 3.49574
100 +: $ 3.27726
250 +: $ 3.05878
500 +: $ 2.84029
1000 +: $ 2.78567
Stock 1000Can Ship Immediately
$ 4.37
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.65°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are devices used to absorb and dissipate the heat generated by electronic components or other external sources while in operation. The ATS-17G-132-C1-R0 is a type of heat sink designed for electronic equipment, primarily servers and other power-intensive computing platforms. It utilizes a combination of aluminum alloy construction and a unique cavity design to provide superior thermal performance.

In terms of construction, the ATS-17G-132-C1-R0 is composed of a base and fins, made from anodized aluminum alloy. The base is slotted to match the length and width of the component or subsystem being cooled, and its surface has been treated with a thermal layer to increase its dispersal properties. The base also features a series of slotted fins for further heat dissipation, along with a special cavity designed to capture and store excess heat from the components.

In terms of performance, the ATS-17G-132-C1-R0 is capable of dissipating up to 131 Watts of power. This allows it to efficiently cool high-wattage components without over-taxing the CPU or other power subsystems. In addition, the ATS-17G-132-C1-R0 is designed to provide superior conformal asset temperature control, ensuring fewer hot spots and improved overall performance. Finally, its aluminum alloy construction ensures a long life span and the ability to withstand harsh environmental conditions.

The ATS-17G-132-C1-R0 is designed to be used in a variety of applications, ranging from server cabinets to industrial control systems. Its primary purpose is to provide efficient, reliable cooling for systems that generate high levels of heat. In this role, it is often used to cool processor-intensive computing platforms, high-speed hard drives, and other high-power components. Additionally, it can be used in areas with high ambient temperatures, since its unique cavity design can absorb and store excess heat until it can be dissipated.

The ATS-17G-132-C1-R0 is an effective, efficient solution for cooling high-wattage electronic components. Through its combination of anodized aluminum alloy construction and a unique cavity design, it provides superior thermal performance and helps to guarantee efficient operation and long-term reliability. Additionally, its wide range of applications makes it a viable solution for a variety of electronic cooling needs.

The specific data is subject to PDF, and the above content is for reference

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