| Allicdata Part #: | ATS-17G-143-C1-R0-ND |
| Manufacturer Part#: |
ATS-17G-143-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-143-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are commonly used in electronics systems to help dissipate thermal energy. In particular, the ATS-17G-143-C1-R0 thermal heat sink is designed to provide an efficient way of dissipating heat from integrated circuit chips and other electronic components.
The ATS-17G-143-C1-R0 thermal heat sink is designed for applications where high performance cooling is necessary. This specific model is made from a die cast aluminum alloy that is designed for maximum heat transfer and dissipating capabilities. The base of the sink also features a thermal conductive material for maximum heat transfer from the IC to the aluminum alloy. The aluminum alloy construction is designed to provide superior thermal stability for long-term use. The ATS-17G-143-C1-R0 also features a special design that allows for better air circulation, which helps dissipate more heat more quickly and efficiently.
The working principle of the ATS-17G-143-C1-R0 is quite simple. It uses the hot air that is generated from the operating integrated circuit chips and other electronic components to transfer its heat away. This is done by using convection, which is the principle of heat transfer from one surface to another without using any form of physical contact. When the hot air rises from the surface of the IC chip, the heat transfers through the conductive material and into the die cast aluminum alloy. Then, the thermal heat sink uses the heat to transfer it away from the chip or other components by dissipating the heat to the surrounding air.
The ATS-17G-143-C1-R0 thermal heat sink is designed for a wide variety of applications that require thermal management. This model is ideal for applications such as high power transistors, high speed integrated circuits, power supplies, and other operations that require a large amount of heat dissipation. The sink can also be used in computer systems, servers, telecommunication devices, and routers that require heat dissipation for high performance cooling.
The ATS-17G-143-C1-R0 thermal heat sink is the ideal solution for a wide range of applications that require superior thermal performance. With its die cast aluminum alloy construction, this model provides an efficient way of dissipating heat away from sensitive components. The thermal conductive material at the base of the sink also helps to increase heat transfer from the IC chip or other components for maximum efficiency. With its efficient working principle and easy installation, the ATS-17G-143-C1-R0 provides an excellent solution for applications requiring high performance thermal management.
The specific data is subject to PDF, and the above content is for reference