| Allicdata Part #: | ATS-17G-161-C3-R0-ND |
| Manufacturer Part#: |
ATS-17G-161-C3-R0 |
| Price: | $ 4.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-161-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.96711 |
| 30 +: | $ 3.74703 |
| 50 +: | $ 3.52661 |
| 100 +: | $ 3.30618 |
| 250 +: | $ 3.08577 |
| 500 +: | $ 2.86535 |
| 1000 +: | $ 2.81025 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are an important component of many electronic systems, as they help dissipate the heat generated by electronic components. ATS-17G-161-C3-R0 is a thermal-heat sink designed to facilitate heat dissipation in electronic systems, and is widely used in LED displays, industrial control boards, and telecom equipment.
The ATS-17G-161-C3-R0 thermal-heat sink is a well-engineered piece of equipment, designed with a combination of precision machining and optimal thermal properties. The sturdy aluminum extrusion utility element of the heat sink provides a strong and reliable base, while the fin design of the thermal element maximizes the surface area to dissipate heat. The aluminum fins are strategically positioned to maximize convection cooling, thus dissipating heat from the entire system.
The ATS-17G-161-C3-R0 thermal-heat sink is also designed with thermally-conductive adhesives to guarantee a strong bond between the components and the heat sink. This ensures efficient heat transfer from the components to the heat sink, which in turn delivers superior cooling performance. The thermal-heat sink also features precision-machined bolt centers, ensuring the attachment of the components to the thermal-heat sink is secure and properly aligned with other components.
The ATS-17G-161-C3-R0 thermal-heat sink is designed to work with a variety of components, including LEDs, power modules, transistors, and resistors. The thermal-heat sink is able to accommodate any component up to a maximum size of 20 x 16 cm, ensuring optimal heat dissipation for applications of any size. The ATS-17G-161-C3-R0 thermal-heat sink is also designed with a built-in temperature sensor, allowing the user to monitor the temperature and adjust the settings accordingly to ensure optimal performance.
The working principle of ATS-17G-161-C3-R0 heat sink is quite simple. The heat generated by the components is transferred to the thermal-heat sink, where it is then dissipated using the efficient cooling properties of the heat sink. The heat transfer is facilitated by the thermally-conductive adhesives, which help ensure that heat transfer is maximized. The aluminum fins of the heat sink act as an effective surface area, which helps dissipate the heat to the surrounding air. Meanwhile, the built-in temperature sensor helps ensure the temperatures remain within healthy levels.
In conclusion, the ATS-17G-161-C3-R0 thermal-heat sink is an effective and reliable solution for efficiently dissipating the heat generated by various types of electronic components. Its precision-machined bolt centers ensure secure and proper component attachment, while its fin design maximizes the surface area for efficient heat transfer. The thermal-heat sink is also designed with a built-in temperature sensor, allowing users to monitor and adjust the settings accordingly to ensure optimal performance.
The specific data is subject to PDF, and the above content is for reference