ATS-17G-162-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.60°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-17G-162-C1-R0ATS-17G-162-C1-R0 is a heat sink manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to provide cooling solutions for high power devices and components such as ICs, processors, and other integrated circuits. Its main features and benefits include high power dissipation capabilities, high quality construction, and high thermal conductivity.Application FieldsThis type of thermal-heat sink is suitable for applications in electronics fields such as digital signal processors, analog signal processors, video cards, microprocessors, embedded systems, automotive electronics, and telecommunications. It can also be used in medical field applications such as pacemakers, medical imaging systems, and MRI systems.Additionally, ATS-17G-162-C1-R0 can be used in industrial applications such as LEDs, industrial controllers, test instrumentation, and robotics. It is also suitable for home audio/video equipment such as audio amplifiers, voice recognition systems, and gaming consoles.Working PrincipleThis thermal-heat sink works on the principles of thermodynamics. It is designed to dissipate the heat generated by ICs and other devices by transferring the heat from the device to the heat-sink and then dissipating the heat into the surrounding air. The heat-sink is designed to provide a large enough surface area to dissipate the generated heat. The heat-sink also has fins that increase the surface area and also aid in dissipating the heat more quickly. Furthermore, the ATS-17G-162-C1-R0 is built with high quality materials that* are designed to be durable and long lasting. The heat-sink also has a high thermal conductivity that enables it to transfer the heat more efficiently. ConclusionATS-17G-162-C1-R0 is a thermal-heat sink designed to provide efficient cooling solutions for high power devices and components. It is suitable for applications in electronics, medical, industrial, and home audio/video equipment. It works on the principles of thermodynamics, with features that increase the surface area and thermal conductivity for high efficiency in dissipating the heat generated by the ICs and other devices.

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