| Allicdata Part #: | ATS29254-ND |
| Manufacturer Part#: |
ATS-17G-165-C2-R0 |
| Price: | $ 3.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-165-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.01770 |
| 10 +: | $ 2.93643 |
| 25 +: | $ 2.85692 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management products are designed to protect sensitive electrical components from extreme temperatures. By dissipating heat away from electronics, it aids in the prevention of thermal runaway and potential damage to both performance and reliability. The ATS-17G-165-C2-R0 is a type of thermal management product known as a heat sink. Heat sinks are metal pieces, usually machined from aluminum or copper, that have fins to increase surface area and facilitate the dissipation of heat.
The ATS-17G-165-C2-R0 is a heat sink specifically designed for use with TO-220, TO-92, and other transistor packages. It has a center hole diameter of 17.0mm, and is composed of 165 aluminum fins. The C2 version of the heat sink also has a square base with a footprint of 25.4×25.4mm. It is recommended for use with transistors measuring a maximum thermal junction temperature of 150°C and a power dissipation of 17 watts.
The principle behind the effectiveness of heat sinks relies on the property known as thermal resistivity. Thermal resistivity is the ability of a material to resist the flow of heat and is expressed as the reciprocal of thermal conductivity, which is the ability of a material to conduct heat. By maximizing the thermal resistivity of the ATS-17G-165-C2-R0, heat is effectively dissipated away from its source, which serves to keep the operating temperature within an optimal range.
The ATS-17G-165-C2-R0 has a wide range of applications due to its versatility and high performance. It can be used in various electronics products including computers, laptops, and industrial control systems. It is an ideal choice for devices in high-power settings that require efficient thermal dissipation. Other applications include automotive electronics, medical and telecom systems, and audio/video systems.
In order to ensure proper installation and maximize the effectiveness of the heat sink, it should be installed with thermal paste. Thermal paste acts as a heat conductive medium with low electrical resistance that fills the microscopic irregularities between the heat sink and the component to improve the thermal interface. This helps to ensure that the heat produced by the integrated circuit is efficiently and effectively transferred to the heat sink.
In summary, the ATS-17G-165-C2-R0 is a heat sink designed for use in high-power applications. It is composed of 165 aluminum fins with a center hole diameter of 17.0mm and a square base footprint of 25.4×25.4mm. The thermal resistivity of the heat sink is maximized to effectively dissipate heat away from its source. It is suitable for use with a variety of devices including electronic systems, automotive electronics, medical and telecom systems, and audio/video systems. For optimum performance, it should be installed with thermal paste.
The specific data is subject to PDF, and the above content is for reference