| Allicdata Part #: | ATS-17G-172-C1-R0-ND |
| Manufacturer Part#: |
ATS-17G-172-C1-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-17G-172-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19788 |
| 30 +: | $ 3.11157 |
| 50 +: | $ 2.93857 |
| 100 +: | $ 2.76576 |
| 250 +: | $ 2.59291 |
| 500 +: | $ 2.50647 |
| 1000 +: | $ 2.24717 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential for maintaining optimal performance and product reliability of electronic devices. One of the most common ways to dissipate heat is to use a thermal heat sink, which is designed to draw heat away from commonly-used electronic components such as CPUs and GPUs. The ATS-17G-172-C1-R0 thermal heat sink is one such device. It works by actively dissipating generated heat away from the device by using a metallic alloy construction with high thermal conductivity.
The ATS-17G-172-C1-R0 thermal heat sink is specifically designed for Intel silicon processors in the mobile and embedded computing markets. It is a high-efficiency heat sink that is suitable for use in applications that require high thermal performance. It features a flat-head feature which allows for improved airflow and improved heat transfer. The metal alloy construction features high thermal conductivity and low thermal impedance, allowing for greater efficiency in heat transfer.
The ATS-17G-172-C1-R0 thermal heat sink has a height of 17mm, making it an optimal size for use in mobile and embedded computing applications. It offers improved rate of airflow over a wide range of temperature ranges and is able to handle temperatures up to 185°C for improved performance. In addition, the heat sink includes an extensive groove feature that helps to reduce thermal resistance and the noise produced by air turbulence. This allows for more efficient cooling.
The ATS-17G-172-C1-R0 thermal heat sink is designed to be attached to the device with a clip or adhesive. It can be easily mounted on any device and offers maximum performance in a variety of situations. It is also aesthetically pleasing and provides added visual appeal to the product. The thermal heat sink is designed to be efficient in terms of both cost and performance, allowing for optimal cooling at an affordable cost.
The ATS-17G-172-C1-R0 thermal heat sink is an excellent choice for applications where high thermal performance is needed. It has a low-profile design and is easy to install, allowing for maximum performance without taking up too much space. In addition, its metal alloy construction offers higher thermal conductivity and low thermal resistance, making it an ideal choice for applications that require reliable cooling without sacrificing performance.
The specific data is subject to PDF, and the above content is for reference